Progressive thermal stress distribution around a crack under Joule heating in orthotropic materials

Song, Haopeng; Xie, Kunkun; Gao, Cun‐Fa

doi:10.1016/j.apm.2020.04.022

Cited by 13 publications

(1 citation statement)

References 29 publications

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“…ese stresses may cause cracks during the heat conduction process, especially during the thermal shock process [5,6]. e thermodynamic analysis is very important to reveal the interaction mechanism between the thermal source and structures [7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

2D Quasi-Static Accurate Solutions for Isotropic Thermoelastic Materials with Applications

Xiao

Tong

Liu

et al. 2021

Mathematical Problems in Engineering

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Thermally induced stress is an important scientific problem in engineering applications. In this paper, an accurate and efficient method for the two-dimensional quasi-static thermal elastic problem is established to explore the thermal stress problem. First, the compact quasi-static two-dimensional general solution is derived in terms of simple potential functions. The general solution is simple in form and can be derived for arbitrary boundary problems subjected to a line heat load. This is completely new to the literature. Second, Green’s function solutions of an infinite plane under the line pulse heat source based on the general solutions are presented to analyze the thermal stress field. Lastly, numerical results are taken into account to study the temperature and stress field induced by the dynamic heat source load. The corresponding analysis can constitute to reveal the mechanism of thermal elastic problems and provide some guidance for experiments or engineering structural design in the future work.

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