Promising high-thermal-conductivity substrate material for high-power electronic device: silicon nitride ceramics

Hu, Feng; Xie, Zhihui; Zhang, Jian; Hu, Zunlan; An, Di

doi:10.1007/s12598-020-01376-7

Cited by 79 publications

(34 citation statements)

References 94 publications

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“…At present, AlN and Si 3 N 4 are commonly used as substrate materials, but their wide applications are limited due to their disadvantages. For example, AlN has low high-temperature strength and fracture toughness [9], and Si 3 N 4 shows insufficient thermal conductivity [10]. If the electrical resistivity of SiC materials can be increased while maintaining the high thermal conductivity, SiC would undoubtedly be a suitable substrate material.…”

Section: Introductionmentioning

confidence: 99%

Effect of Sintering Temperature on the Properties of Highly Electrical Resistive SiC Ceramics as a Function of Y2O3-Er2O3 Additions

Yao

Liu

et al. 2020

Materials

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Silicon carbide (SiC) ceramics with Y2O3-Er2O3 as sintering additives were prepared by spark plasma sintering (SPS). The effects of sintering temperatures and Y2O3-Er2O3 contents on the microstructure, thermal conductivity, electrical, and mechanical properties were investigated. The increasing of sintering temperatures promoted the densification of SiC ceramics, thus increasing the thermal conductivity and electrical resistivity. With the increase of the sintering additive contents, the electrical resistivity increased due to the formation of the electrical insulating network; and the thermal conductivity first increased and then decreased, which was related to the content and distribution of the secondary phase among the SiC grains. The SiC ceramics sintered at 2000 °C with 9 wt.% Y2O3-Er2O3 exhibited higher electrical resistivity and thermal conductivity, which were 4.28 × 109 Ω·cm and 96.68 W/m·K, respectively.

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Section: Introductionmentioning

confidence: 99%

Effect of Sintering Temperature on the Properties of Highly Electrical Resistive SiC Ceramics as a Function of Y2O3-Er2O3 Additions

Yao

Liu

et al. 2020

Materials

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“…The method of adding fillers is a fast way to improve the thermal conductivity of polymers. Metal materials (such as copper powder [ 7 , 8 , 9 ], silver powder [ 10 , 11 ], metal sheet and wire [ 12 , 13 , 14 ]), carbon materials (such as carbon fiber (CF) [ 15 , 16 , 17 ], graphene material [ 18 , 19 ], graphite material [ 20 , 21 ], carbon nanotubes [ 22 , 23 ], carbon black [ 24 , 25 ]), inorganic fillers (such as aluminum nitride [ 26 , 27 ], boron nitride [ 28 , 29 , 30 ], silicon nitride [ 31 , 32 ], silicon carbide [ 33 ], alumina [ 34 , 35 ]) and other high thermal conductivity fillers are often used to improve the thermal conductivity of polymers. When the particulate filler content is small, it is difficult to significantly improve the thermal conductivity of the matrix.…”

Section: Introductionmentioning

confidence: 99%

3D Thermal Network Supported by CF Felt for Improving the Thermal Performance of CF/C/Epoxy Composites

Jiang

Zheng

et al. 2021

Polymers

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The heat generated by a high-power device will seriously affect the operating efficiency and service life of electronic devices, which greatly limits the development of the microelectronic industry. Carbon fiber (CF) materials with excellent thermal conductivity have been favored by scientific researchers. In this paper, CF/carbon felt (CF/C felt) was fabricated by CF and phenolic resin using the “airflow network method”, “needle-punching method” and “graphitization process method”. Then, the CF/C/Epoxy composites (CF/C/EP) were prepared by the CF/C felt and epoxy resin using the “liquid phase impregnation method” and “compression molding method”. The results show that the CF/C felt has a 3D network structure, which is very conducive to improving the thermal conductivity of the CF/C/EP composite. The thermal conductivity of the CF/C/EP composite reaches 3.39 W/mK with 31.2 wt% CF/C, which is about 17 times of that of pure epoxy.

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“…8 β-Si 3 N 4 instead of α-Si 3 N 4 is usually used as a thermal conductive filler because it has a higher thermal conductivity than α-Si 3 N 4 . [9][10][11][12] For preparing thermally conductive composites, the combination of several fillers with different particle sizes is effective to increase the fraction of fillers and thus improve the thermal conductivity. [13][14] Therefore, it is necessary to prepare β-Si 3 N 4 powders with different particle sizes.…”

Section: Introductionmentioning

confidence: 99%

Coarse‐grained β‐Si₃N₄ powders prepared by combustion synthesis

Cui

Tian

et al. 2021

J. Am. Ceram. Soc.

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Coarse-grained β-Si 3 N 4 powders were prepared by combustion synthesis under N 2 pressure of 6 MPa, with a low diluent content of not more than 10 wt.% and high reaction temperature of >1900°C. β-Si 3 N 4 was obtained as the major phase in the products, except for a small amount of residual Si. The addition of carbon black was effective to reduce the residual Si, but resulted in the formation of β-SiC when too much carbon black was used. The coarse-grained β-Si 3 N 4 powders consisted of β-Si 3 N 4 crystals with an average thickness of more than 10 µm, and some crystals were thicker than 20 µm. The growth mechanism of the coarse β-Si 3 N 4 crystals was discussed, associated with the particular reaction conditions in combustion synthesis. K E Y W O R D S coarse-grained β-Si 3 N 4 , combustion synthesis, growth mechanism How to cite this article: Cui W, Li F, Tian Z, et al. Coarse-grained β-Si 3 N 4 powders prepared by combustion synthesis.

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Promising high-thermal-conductivity substrate material for high-power electronic device: silicon nitride ceramics

Cited by 79 publications

References 94 publications

Effect of Sintering Temperature on the Properties of Highly Electrical Resistive SiC Ceramics as a Function of Y2O3-Er2O3 Additions

Effect of Sintering Temperature on the Properties of Highly Electrical Resistive SiC Ceramics as a Function of Y2O3-Er2O3 Additions

3D Thermal Network Supported by CF Felt for Improving the Thermal Performance of CF/C/Epoxy Composites

Coarse‐grained β‐Si₃N₄ powders prepared by combustion synthesis

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Promising high-thermal-conductivity substrate material for high-power electronic device: silicon nitride ceramics

Cited by 79 publications

References 94 publications

Effect of Sintering Temperature on the Properties of Highly Electrical Resistive SiC Ceramics as a Function of Y2O3-Er2O3 Additions

Effect of Sintering Temperature on the Properties of Highly Electrical Resistive SiC Ceramics as a Function of Y2O3-Er2O3 Additions

3D Thermal Network Supported by CF Felt for Improving the Thermal Performance of CF/C/Epoxy Composites

Coarse‐grained β‐Si3N4 powders prepared by combustion synthesis

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Coarse‐grained β‐Si₃N₄ powders prepared by combustion synthesis