2008
DOI: 10.1016/j.apsusc.2008.07.179
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Promoting strain relaxation of Si0.72Ge0.28 film on Si (100) substrate by inserting a low-temperature Ge islands layer in UHVCVD

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Cited by 7 publications
(1 citation statement)
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“…8) However, for most of the growth techniques, the relaxation degree is insufficient, even if the SiGe layer thickness is much larger than the critical thickness for strain relaxation. 9) As reported in Ref. 10, aggregation of over-pressurized H bubbles can contribute to strain relaxation and reduce the threading dislocation density through interactions with dislocation loops.…”
mentioning
confidence: 83%
“…8) However, for most of the growth techniques, the relaxation degree is insufficient, even if the SiGe layer thickness is much larger than the critical thickness for strain relaxation. 9) As reported in Ref. 10, aggregation of over-pressurized H bubbles can contribute to strain relaxation and reduce the threading dislocation density through interactions with dislocation loops.…”
mentioning
confidence: 83%