Microelectronics
based on Si requires metal silicide contacts.
The ability to form platinum silicide (Pt
2
Si) by electronic
excitation instead of thermal processes would benefit the field. We
studied the effects of electron irradiation on Pt
2
Si formation
in composite films—composed of Pt and amorphous silicon oxides
(a-SiO
x
)—by transmission electron
microscopy and electron diffraction. Pt
2
Si formed in Pt/a-SiO
x
bilayer and a-SiO
x
/Pt/a-SiO
x
sandwiched films by 75 keV
electron irradiation, at 298 and 90 K. The reaction is attributable
to dissociation of SiO
x
triggered by electronic
excitation. In a-SiO
x
/Pt/a-SiO
x
sandwiched films, reflections of pure Pt were
not present after irradiation, i.e., Pt was completely consumed in
the reaction to form Pt
2
Si at 298 K. However, in Pt/a-SiO
x
bilayer films, unreacted Pt remained under
the same irradiation conditions. Thus, it can be said that the extent
of the interfacial area is the predominant factor in Pt
2
Si formation. The morphology of Pt islands extensively changed during
Pt
2
Si formation even at 90 K. Coalescence and growth of
metallic particles (Pt and Pt–Si) are not due to thermal effects
during electron irradiation but to athermal processes accompanied
by silicide formation. To maintain the reaction interface between
metallic particles and the dissociation product (i.e., Si atoms) by
electronic excitation, a considerable concomitant morphology change
occurs. Elemental analysis indicates that the decrease in Si concentration
near Pt is faster than the decrease in O concentration, suggesting
formation of a Si depletion zone in the amorphous silicon oxide matrix
associated with formation of Pt
2
Si.