2008
DOI: 10.1149/1.2937591
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Promotion of ESD-CDM Immunity in Dicing Saw Process

Abstract: Polyimide (PI) dielectric as a heatproof material is popularly adopted in integrated circuit (IC) industry. In assembly dicing saw process, the de-ionized (D.I.) water shows the higher resistance and rubs with PI material. Therefore, the negative electrostatic charges are generated and accumulated to gate oxide capacitor or p-n junction capacitor in IC chips. Because the discharge path is isolated in this time, the sufficiently cumulative charges will damage the IC devices in this process step. These damaged I… Show more

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