Propagation characteristics of high-T/sub c/ superconducting interconnect for VLSI packaging predicted by a generalized two-fluid model

Abstract

A generalized two-fluid model is used to analyze the propagation characteristics of high-Tc superconducting interconnects for very large scale integration (VLSI) packaging. The comparisons for surface impedance of YBa 2 Cu 3 O 70x (YBCO) single crystals and thin films show data are in good agreement with the generalized two-fluid model. Based on the generalized two-fluid model, the temperature-and frequency-dependences of the attenuation constant are calculated, the transient responses of a pulse transmitted on a high-Tc superconducting interconnect are simulated, and a simple semi-empirical expression for rise time is given. The results based on the generalized two-fluid model predict an optimum operation temperature range for YBCO interconnect near at liquid nitrogen temperature.