Properties and Aging of Bottom-Contact CuO/Au Transmission Line Model (TLM) Structures

Zeng, Xi; Zhukova, Maria; Faniel, Sébastien; Li, Guoli; Flandre, Denis

doi:10.1109/ted.2024.3441565

IEEE Trans. Electron Devices

2024

DOI: 10.1109/ted.2024.3441565

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Properties and Aging of Bottom-Contact CuO/Au Transmission Line Model (TLM) Structures

Xi Zeng,

Maria Zhukova,

Sébastien Faniel

et al.

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Properties and Aging of Bottom-Contact CuO/Au Transmission Line Model (TLM) Structures

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References 33 publications

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