Properties of electroless and electroplated Ni–P and its application in microgalvanics

Peeters, P.; Hoorn, G.v.d.; Daenen, T.; Kurowski, A.; Staikov, G.

doi:10.1016/s0013-4686(01)00546-1

Cited by 109 publications

(44 citation statements)

References 3 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Early work on melt-spun amorphous Ni-P alloys claimed them to be ''enriched in elemental phosphorus'' [10][11][12] but assigned phosphorus in the bulk alloy to ''elemental phosphorus''. This opinion was cited repeatedly until publication of the results of recent work [25,26]. On the other hand, the authors' work on amorphous Fe70Cr10P13C7 alloys has shown that phosphorus in the bulk of this alloy has a partial negative charge [23,24] in agreement with the literature data for Ni-P alloys [27,28] and on a series of binary nickel-phosphides [29].…”

Section: Introductionmentioning

confidence: 65%

Electroless deposited Ni–P alloys: corrosion resistance mechanism

et al. 2008

View full text Add to dashboard Cite

Electroless Ni-P alloys are produced as coatings on a broad variety of substrates. They exhibit a corrosion resistance that is superior to pure nickel but do not form a NiO oxide film (passive film) as pure nickel does. Despite the fact that many mechanisms have been proposed to explain this superior corrosion behaviour, no consensus has yet been reached. In this work electrochemical and XPS surface analytical methods have been combined in order to gain a deeper insight into the mechanisms underlying the corrosion resistance of electroless deposited Ni-P alloys with phosphorus content between 18 and 22 at.%. The anodic polarization curves in acidic and neutral solutions confirm a broad current plateau followed by a region with increasing current density. During potentiostatic polarization in the plateau region the current decays according to a power law with exponent ca. -0.5 indicating diffusion-limited dissolution of nickel. XPS/XAES measurements performed after potentiostatic polarization show that phosphorus is present in three different chemical environments. Based on the Auger parameter concept and on the chemical state plot, the three phosphorus states were assigned to phosphorus in the bulk alloy, phosphates and an intermediate phosphorus compound attributed to elemental phosphorus. Angle-resolved XPS analysis has shown that the elemental phosphorus is enriched at the interface between the alloy and the outermost surface in contact with the corrosive solution. These results suggest the following conclusions: the high corrosion resistance of electroless deposited Ni-P alloys can be explained by a strong enrichment of elemental phosphorus at the interface which limits the dissolution of nickel via a diffusion mechanism. A complementary explanation--not yet advanced--for the high corrosion resistance may lie in the electronic state of nickel in the Ni-P alloys.

show abstract

Section: Introductionmentioning

confidence: 65%

Electroless deposited Ni–P alloys: corrosion resistance mechanism

et al. 2008

View full text Add to dashboard Cite

show abstract

“…Peeters and co-workers showed that the roughness between electroplated and electroless Ni-P was comparable. 18 In this study, the EP Ni-P could be deposited with a faster deposition rate than EN, and exhibited appropriate surface roughness. In fact, the surface roughness is one of the critical factors that can affect wettability between the solder paste and UBM.…”

Section: Morphology and Structure Of Ep Ni-p With Various Phosphorousmentioning

confidence: 92%

Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder

Lin

Duh

Chiou

2006

Journal of Elec Materi

View full text Add to dashboard Cite

Nickel plating has been used as the under bump metallurgy (UBM) in the microelectronics industry. In this study, the electroplating process was demonstrated to be agood alternative approach to produce the Ni-P layer as UBM. The wettability of several commercial solder pastes, such as Sn-3.5Ag, Sn37Pb, and Sn-3Ag-0.5Cu solder, on electroplated Ni-P with various phosphorous contents (7 wt.%, 10 wt.%, and 13 wt.%) was investigated. The role of phosphorus in the wettability was probed. The surface morphology and surface roughness in electroplated Ni-P was observed with the aid of both field emission scanning electron microscope (SEM) and atomic force microscope (AFM). The correlation between wettability and phosphorus contents in electroplated Ni-P was evaluated. As the phosphorous contents increased, the surface morphology of the Ni-P deposit was smoother and surface roughness of Ni-P became smaller. The improvement of surface morphology and surface roughness enhanced the wettability of electroplated Ni-P. The interfacial reaction between lead-free solder and electroplating Ni-P UBM was also investigated.

show abstract

“…9) in all sizes of the pattern were the reasons for a similar hardness of NiP. Furthermore, the hardness of NiP patterns was approximately 12 GPa, which was relatively higher than the typical hardness of amorphous NiP (5-9 GPa [23][24][25] ), due to ISE as described in Fig. 7.…”

Section: Initial Deposition Of Nip At Various Pattern Sizes Ofmentioning

confidence: 63%

Nanoindentation Analysis for Mechanical Properties of Electroless NiP Imprinting Mold Replicated from Self-Assembled-Monolayer Modified Master Mold

Lin

Saito

Homma

2013

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

A NiP imprinting mold with patterns, whose size is from nanometer to submicrometer (170, 500, and 1000 nm diameter), was fabricated by electroless deposition of NiP on a 3-aminopropyltriethoxysilane (APTES) modified master mold. The NiP deposit as a replicate mold was then detached from the master mold. The initial NiP deposition in patterns of the master mold was investigated; moreover, nanoindentation was successfully performed on a single NiP pattern for investigating the hardness. The NiP had a similar grain size in different sizes of patterns of the master mold during the initial deposition, as well as the same hardness of the NiP patterns (approximately 12 GPa) was observed. These results indicated that the initial NiP deposition and hardness of NiP were not size dependent above 170 nm. The surface morphology of the NiP detached from the master mold and NiP pattern of different sizes were investigated as well. #

show abstract

Properties of electroless and electroplated Ni–P and its application in microgalvanics

Cited by 109 publications

References 3 publications

Electroless deposited Ni–P alloys: corrosion resistance mechanism

Electroless deposited Ni–P alloys: corrosion resistance mechanism

Wettability of electroplated Ni-P in under bump metallurgy with Sn-Ag-Cu solder

Nanoindentation Analysis for Mechanical Properties of Electroless NiP Imprinting Mold Replicated from Self-Assembled-Monolayer Modified Master Mold

Contact Info

Product

Resources

About