Properties of high-temperature epoxy/DDS resin systems for bonding application

Abstract

The choice of basic epoxy resin (ER) is especially important for the design of epoxy adhesive formulations. In the present study, performance of several high-temperature ER systems, prepared using 4,4-diaminodiphenylsulfone as the curing agent by the same curing process, was investigated. The curing behavior was studied by dynamic rheometry and differential scanning calorimetry. The thermal properties of the cured resins were investigated by dynamic thermomechanical analysis, thermomechanical analysis, and thermogravimetric analysis. The peeling properties, mechanical behaviors, and moisture absorptivities of the cured resins were also studied. The results showed traditional diglycidyl ether of bisphenol A epoxy to be insufficient in heat resistance. Naphthalene-based ER and bifunctional cardo ER showed higher glass transition temperature values. However, the processability and adhesive properties may not comply with the application requirements. Biphenyl novolac ER has excellent performance in all aspects, which is suitable for use as a high-temperature adhesive.

Aromatic tetra-glycidyl ether versus tetra-glycidyl amine epoxy networks: Influence of monomer structure and epoxide conversion

“…For systematically varying glassy epoxy networks, increases in g have been discussed in terms of increasing free volume facilitating movement of chain segments [37] and reduced cure conversion [17], while decreases have been attributed to increases in the crosslink density and density of the aromatic structure of the network. Zhou et al studied several highly aromatic glycidyl ether networks and reported lower g for a bis-naphthalene epoxy resin when compared with other epoxy resins due to the restriction of movement of the planar structure leading to enhanced interactions and a stacked network structure [38]. All of these competing trends are apparent in the thermal expansion measurements obtained here, from the increasing cure temperature and post-cured NNE, NTG and TGDDM networks.…”

Studies on mechanical, thermal and tribological properties of carbon fibre-reinforced boron nitride-filled epoxy composites

“…55 For clarity, all the composite’s DSC scan curves were shifted to the right side. 56 The BN1% composites showed lower endothermic peak and its DSC test travel curve is almost a straight line indicating shortest cure time required for the composites to get cured compared to all other composites. The degree of curing and cross-linking reaction of Ep system in the composites are reflected by the degree of cure.…”

Reinforcement of Aminopropyl-Terminated Siloxane-Treated Carbon Nanotubes in Epoxy Thermosets: Mechanical and Thermal Properties

“…The invention and application of epoxy resins have brought great convenience to people's lives [1]. Epoxy resins are widely used in industry for various applications, such as adhesives [2][3][4], coatings [5,6], packaging [7,8], and other structural materials [9][10][11]. The epoxy resins have a higher degree of crosslinks, thus showing thermosetting properties; for instance, higher degrees of rigidness and better strength and dimensional stability.…”