Properties of lead-free solder alloys with rare earth element additions

Wu, Chi‐Man Lawrence; Yu, Daquan; Law, Chun Hung Roberts; Wang, Lu

doi:10.1016/j.mser.2004.01.001

Cited by 543 publications

(236 citation statements)

References 79 publications

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“…These IMCs, rich in Ag and Cu, are brittle in nature in comparison with the soft Sn matrix and affect the mechanical properties of leadfree solders. 13 The size of these particles depends on many parameters such as alloy composition, cooling rate, and environmental conditions during service with temperature up to 175°C and aging time up to several hundred hours. In order to constrain the size of these IMCs, many researchers attempted a change in the cooling rate during the solidification process.…”

Section: Resultsmentioning

confidence: 99%

“…This refinement is due to the particular effect of lanthanum adsorption at different planes in the SAC alloys. 8,13,25 Mechanical Properties Figure 10a shows the yield stress and tensile strength for the as-cast samples at room temperature. A significant increase in both yield stress and tensile strength is observed.…”

Section: Grain Sizementioning

confidence: 99%

“…This may be due to an increase in the quantity of hard, RE-bearing particles. 8,13 In Ref. 26, it is shown that lanthanum results in the formation of LaSn 3 compounds.…”

Section: Grain Sizementioning

confidence: 99%

“…Thus, it is expected that La doping will increase the creep life of SAC alloys, as also presented by many researchers. 9,13,28 CONCLUSIONS Doped SAC alloys have been studied to determine the influence of lanthanum on their microstructure evolution and mechanical properties at high temperature. Several conclusions can be made.…”

Section: Grain Sizementioning

confidence: 99%

“…Similarly, in Ref. 13, the impact of isothermal aging on RE-doped Sn-Cu alloys was studied. Hao et al 14 systematically investigated the evolution of microstructure and IMCs for SAC solder modified with trace amounts of the rare-earth element Er (addition of 0.15 wt.% Er to SAC387) during isothermal aging.…”

Section: Introductionmentioning

confidence: 99%

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Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders

Sadiq

Pesci

Cherkaoui

2013

Journal of Elec Materi

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is an open access repository that collects the work of Arts et Métiers ParisTech researchers and makes it freely available over the web where possible. An extensive study is made to analyze the impact of pure lanthanum on the microstructure and mechanical properties of Sn-Ag-Cu (SAC) alloys at high temperatures. Different compositions are tested; the temperature applied for the isothermal aging is 150°C, and aging times of 10 h, 25 h, 50 h, 100 h, and 200 h are studied. Optical microscopy with cross-polarized light is used to follow the grain size, which is refined from 8 mm to 1 mm for as-cast samples and is maintained during thermal aging. Intermetallic compounds (IMCs) present inside the bulk Sn matrix affect the mechanical properties of the SAC alloys. Due to high-temperature exposure, these IMCs grow and hence their impact on mechanical properties becomes more significant. This growth is followed by scanning electron microscopy, and energy-dispersive spectroscopy is used for elemental mapping of each phase. A significant refinement in the average size of IMCs of up to 40% is identified for the as-cast samples, and the coarsening rate of these IMCs is slowed by up to 70% with no change in the interparticle spacing. Yield stress and tensile strength are determined through tensile testing at 20°C for as-cast samples and after thermal aging at 150°C for 100 h and 200 h. Both yield stress and tensile strength are increased by up to 20% by minute lanthanum doping.

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Section: Resultsmentioning

confidence: 99%

Section: Grain Sizementioning

confidence: 99%

“…This may be due to an increase in the quantity of hard, RE-bearing particles. 8,13 In Ref. 26, it is shown that lanthanum results in the formation of LaSn 3 compounds.…”

Section: Grain Sizementioning

confidence: 99%

Section: Grain Sizementioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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