Physical Properties of Polymers Handbook 2007
DOI: 10.1007/978-0-387-69002-5_57
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Properties of Photoresist Polymers

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Cited by 15 publications
(10 citation statements)
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“…Conversely, negative photoresists are hardened by UV-light exposure, and thus a solvent will wash away the unexposed areas, resulting in an inverse pattern of the mask (a negative of the desired microfluidic design). Although negative photoresists are more prone to pattern distortions than their positive counterparts, they have better adhesion to different materials and lower manufacturing costs, making them a better choice when the process does not require very high resolution 35 . Depending on the desired purpose, thickness and adhesion, several manufacturers offer a wide range of positive and negative photoresists.…”
Section: Experimental Designmentioning
confidence: 99%
“…Conversely, negative photoresists are hardened by UV-light exposure, and thus a solvent will wash away the unexposed areas, resulting in an inverse pattern of the mask (a negative of the desired microfluidic design). Although negative photoresists are more prone to pattern distortions than their positive counterparts, they have better adhesion to different materials and lower manufacturing costs, making them a better choice when the process does not require very high resolution 35 . Depending on the desired purpose, thickness and adhesion, several manufacturers offer a wide range of positive and negative photoresists.…”
Section: Experimental Designmentioning
confidence: 99%
“…In addition to detecting inflammatory and disease foci, photosensitive compounds are also used in anti-cancer therapy (so-called photodynamic therapy, PDT). Photosensitive compounds are also widely applied in modern technologies, e.g., as photoresists for optical lithography [ 6 , 7 ], sensitizers for solar cells [ 8 ], or initiators in fast photopolymerization processes [ 9 ], and recently also in light-controlled radical polymerization [ 10 ].…”
Section: Introductionmentioning
confidence: 99%
“…Photolithography [ 4 ] is most commonly used in the microelectronics industry. The topology obtained with this technology is formed due to a photomask [ 5 ], a replica of which is created on the surface of a substrate by illuminating the photoresist [ 6 ] deposited on the surface through this photomask. After the photoresist has been developed, it is possible to etch the substrate or apply layers to obtain the desired topology.…”
Section: Introductionmentioning
confidence: 99%