Properties of Sn-3 wt%Ag-5 wt%Cu alloys with Cu6Sn5 intermetallics grain refined by Mg

Tan, Chi; Salleh, Mohd Arif Anuar Mohd; Tan, Xin; Yasuda, Hideyuki; Saud, Norainiza; Ramli, Mohd Izrul Izwan; Nogita, Kazuhiro

doi:10.1016/j.mtcomm.2022.103221

Cited by 8 publications

(1 citation statement)

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“…In recent years, the addition of Mg has emerged as a promising strategy to enhance the performance of these alloys. Tan et al [17] conducted a comprehensive study on the impact of Mg addition on the microstructure and properties of Sn-3Ag-5Cu (wt.%) solder alloys. Their findings revealed that incorporating 0.1wt.% Mg effectively refines the primary Cu 6 Sn 5 IMCs, reduces the thickness of the interfacial intermetallic compounds (IMCs) layer, and enhances the ductility at the solder joint's interfacial layer.…”

Section: Introductionmentioning

confidence: 99%

The Influence of Interfacial Thermal Conductance on the Tensile Strength of a Sn-Mg Solder Alloy

Cruz,

Soares,

Barros

et al. 2023

Metals

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Sn-Mg alloys are potential Pb-free solder options. However, their mechanical strength and interfacial characteristics with electronic substrates remain barely understood. This study focuses on the interfacial heat transfer aspects, microstructure, and tensile strength of a Sn-2.1wt.%Mg alloy. Samples with various thermal histories were produced using a directional solidification apparatus. In these experiments, a Sn-2.1wt.%Mg alloy was solidified on Cu and Ni substrates, which are of interest in the electronics industry. Mathematical modeling was then employed, allowing for the determination of the overall and interfacial heat transfer coefficients (hov, and hi, respectively). The results show that the Ni substrate exhibits higher interfacial thermal conductance with the Sn-2.1wt.%Mg alloy compared to the Cu substrate, as indicated by the higher hi profiles. This fact occurs mainly due to their metallurgical interaction, resulting in a stronger bond with the presence of Sn-Ni-rich intermetallics at the interface. Finally, experimental equations based on the Hall–Petch relationship are proposed to describe how the refinement of the fibrous spacing of the Mg2Sn interphase (λG) and an increase in hi enhance both yield and ultimate tensile strengths.

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Section: Introductionmentioning

confidence: 99%