Properties of solders with low melting point

Chriašteľová, Janka; Ožvold, Milan

doi:10.1016/j.jallcom.2007.03.062

Cited by 35 publications

(16 citation statements)

References 5 publications

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“…However, the relatively low mechanical strength and melting temperature (138°C) of these materials require improvement for their more effective use in flexible interconnection applications [3,15]. Comparatively, Sn-In solder, which has a low melting temperature (118 °C), has excellent electrical and thermal properties [12,16]. However, the price of In is very high, and this material includes high amounts of IMCs, which degrade the mechanical properties of the solder [16].…”

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

“…Comparatively, Sn-In solder, which has a low melting temperature (118 °C), has excellent electrical and thermal properties [12,16]. However, the price of In is very high, and this material includes high amounts of IMCs, which degrade the mechanical properties of the solder [16]. Thus, the incorporation of additives, including alloying, doping, or the use of reinforcement materials, into Sn-Bi or Sn-In alloy systems has been considered a useful strategy for improving the mechanical properties.…”

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

“…The microstructure reflects the mechanical properties of a solder [15][16][17][18][19][20][21]. Based on the microstructural analysis of low melting point solders, specific phases and their distribution in the microstructure can be observed, and these characteristics can be used to describe intended properties [15][16][17][18][19][20][21].…”

Section: Microstructure With Regard To Grain Size and Solid Solutionmentioning

confidence: 99%

“…Based on the microstructural analysis of low melting point solders, specific phases and their distribution in the microstructure can be observed, and these characteristics can be used to describe intended properties [15][16][17][18][19][20][21]. In this section, we show how the microstructure of low melting point solders is altered by the incorporation of an additive, especially with regard to grain size and solid solution.…”

Section: Microstructure With Regard To Grain Size and Solid Solutionmentioning

confidence: 99%

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Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Kim¹,

Yang²

2017

Recent Progress in Soldering Materials

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The increasing application of heat-sensitive microelectronic components such as a multitude of transistors, polymer-based microchips, and so on, and flexible polymer substrates including polyethylene terephthalate (PET) and polyimide (PI), among others, for use in wearable devices has led to the development of more advanced, low melting temperature solders (<150°C) for interconnecting components in various applications. However, the current low melting temperature solders face several key challenges, which include more intermetallic compound formation (thus become more brittle), cost issues according to the addition of supplementary elements to decrease the melting point temperature, an increase in the possibility of thermal or popcorn cracking (reliability problems), and so on. Furthermore, the low melting temperature solders are still required to possess rapid electronic/electrical transport ability (high electrical conductivity and current density) and accompany strong mechanical strength sustaining the heavy-uploaded microelectronic devices on the plastic substrates, which are at least those of the conventional melting temperature solders (180-230°C). Thus, the pursuit of more advanced low melting temperature solders for interconnections is timely. This review is devoted to the research on three methods to improve the current properties (i.e., electrical and thermomechanical properties) of low melting temperature solders: (i) doping with a small amount of certain additives, (ii) alloying with a large amount of certain additives, and (iii) reinforcing with metal, carbon, or ceramic materials. In this review, we also summarize the overall recent progress in low melting temperature solders and present a critical overview of the basis of microscopic analysis with regard to grain size and solid solutions, electrical conductivity by supplementation with conductive additives, thermal behavior (melting point and melting range) according to surface oxidation and intermetallic compound formation, and various mechanical properties.

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Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

Section: Syntheses And/or Fabrications Of Low Melting Temperature Solmentioning

confidence: 99%

Section: Microstructure With Regard To Grain Size and Solid Solutionmentioning

confidence: 99%

Section: Microstructure With Regard To Grain Size and Solid Solutionmentioning

confidence: 99%

See 2 more Smart Citations

Low Melting Temperature Solder Materials for Use in Flexible Microelectronic Packaging Applications

Kim¹,

Yang²

2017

Recent Progress in Soldering Materials

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“…Microstructure, electrical, mechanical and thermal properties of rapidly solidified Bi58Sn42 eutectic alloy have been investigated [13]. Thermal properties and microstructure of 58% Bi-42% Sn, 53% Bi-26% Sn-21% Cd,70% In-30% Sn, 50% Sn-50% In and 3% Sn-37% Bi-10% In solder alloys have been studied and analyzed [14]. Attenuation coefficients, structure and physical properties of Bi-Pb-Sn fusible alloys were studied [15].…”

Section: Introductionmentioning

confidence: 99%

New Penta Bismuth Based Alloy for Shielding Blocks in Mega-Volt Radiotherapy

Bediwi¹,

Dawood²,

Kamal³

2015

IJSEA

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Microstructure, thermal, electrical and mechanical properties of penta Bi-Sn-Pb based alloys have been investigated. Matrix structure (Formed crystalline phases) and measured physical properties of Bi-Sn-Pb-In-X (X= Cd/or Zn) penta alloys changed with varying composition. The new penta fusible, Bi50Pb15Sn22Cd3In10, alloy has best properties such as high density, low melting point and friendly environmental, (reduced toxicity elements Pb and Cd by 40% and 75%, compared used alloys), for shielding blocks in mega-volt radiotherapy. The melting temperature of Bi50Pb15Sn22Cd3In10 alloy is ~58 ºC and it is density is 10.117 gm/cm 3 . The elastic modulus of Bi50Pb15Sn22Cd3In10 is 29.03 Gpa. Vickers hardness and internal friction values of Bi50Pb15Sn22Cd3In10 alloy are 9.72 Kg/mm 2 and 0.085. The Bi50Pb15Sn22Cd3In10 alloy consists of rhombohedral Bi phase, tetragonal Sn phase, face centered cubic Pb phase, hexagonal Cd phase, face centered cubic In phase, Pb7Bi3 and SnBi intermetallic compounds..

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