Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses

Vianco, Paul T.; Rejent, Jerome A.

doi:10.1007/s11664-999-0251-3

Cited by 101 publications

(63 citation statements)

References 2 publications

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“…It was also already shown that bismuth and silver can have a significant impact on the corrosion properties in case of Sn-based solder alloy in NaCl solutions [17,18]. Furthermore, the influence of bismuth addition on the microstructure and the properties of Sn-rich SnAg lead-free solders has been also widely studied [13,[19][20][21][22][23]. However, the effect of bismuth on the corrosion behaviour in the case of micro-alloyed solder alloy is not deeply addressed in the literature.…”

Section: Discussionmentioning

confidence: 99%

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Tamasi

Kosa

Szabó

et al. 2016

Period. Polytech. Elec. Eng. Comp. Sci.

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IntroductionOne of the key reliability issues of the electronics technology is carry about the solder joints testing. Usually, the different failures can lead back to the not adequate physical properties (e.g. wetting behaviour, mechanical strength, etc.) of the solder alloy and/or the not adequate applied technological processes (e.g. reflow temperature profile), which have to be improved. This challenge was updated in 2006, with the introduction of lead-free solder alloys governed by the RoHS directive of EU [1]. Due to the lead-free limitations, different solder types such as near-eutectic Tin-Silver, Tin-Copper, and Tin-Zinc alloys were produced as replacement for Tin-Lead solder materials. Furthermore, solders with more alloying elements, such as (Tin-Silver-Copper, Tin-Zinc-Silver, Tin-Zinc-Indium) and/or (Tin-Zinc-Silver-Aluminum, Tin-Silver-Bismuth-Copper, TinIndium-Silver-Antimony) were also investigated as replacements for Pb-free types [2]. While, the different qualifying studies of the Pb-free solder alloys are even active topics [3] and one of the issues is carry about humidity induced failures, like electrochemical corrosion [4,5]. Different results were also published related to novel Pb-free solder alloys in terms of reliability topics, such as solderability [6], intermetallic layer (IML) investigation [7], shear force tests [8], wetting investigations [9] or (solid state physics) migration tests [10]. On the other hand, the investigations of humidity induced failures (like corrosion) of Pb-free solder alloys are not deeply addressed in the scientific publications. In our former publication [11], various microalloyed Pb-free solders tested in terms of corrosion resistance using electroanalytical tests. In that study [11] different Pb-free solder alloys (four micro-alloyed and a Sn96.5Ag3Cu0.5 alloy as reference) were compared using potentiodynamic polarisation tests. During polarisation tests, the sample (working electrode) is scanned from a cathodic polarisation state, and after reaching the corrosion potential (Ecorr) it begins anodic polarisation. When the sample reaches the passivation potential, if possible a passivation film begins to form on the surface and the current density at this point is called the critical current density (Icrit). After this point the corrosion current density begins to drop to a much lower value. When a compact passivation film

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Section: Discussionmentioning

confidence: 99%

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Tamasi

Kosa

Szabó

et al. 2016

Period. Polytech. Elec. Eng. Comp. Sci.

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“…While the increase in the tensile strength with Bi addition less than 5 mass%, the solubility limit of Bi in Sn, could be due to solid solution hardening, further strength increment with Bi addition beyond its solubility limit would be attributed to Bi precipitation. 7,8) Figure 6 shows SEM micrographs of Sn-3.5Ag-Bi solder alloys. Bi precipitates were clearly observed for Sn-3.5Ag-Bi alloys with Bi content more than 3 mass%.…”

Section: Characteristics Of Sn-35ag-bi Solder Alloysmentioning

confidence: 99%

“…As shown in Bi addition less than 5 mass%, and by dispersion hardening of Bi precipitates with Bi addition beyond its solubility limit. 7,8) With applying such strengthening mechanisms to the shear strength change of the solder bumps (Fig. 8), it seems that dispersion hardening with Bi precipitates is not as effective as solid solution hardening is to improve the shear strength of Sn-3.5Ag-Bi solder bumps.…”

Section: Shear Strength and Fracture Behavior Of Sn-35ag-mentioning

confidence: 99%

“…1,2,6) Thus, many works have been conducted to modify the thermal and mechanical characteristics of Sn-3.5Ag solder with addition of Bi, Cu, Sb, In, and Zn as a ternary element. 1,3,[5][6][7][8] In this study, tensile strength and fracture energy of Sn-3.5Ag-Bi alloys were characterized with Bi addition up to 9 mass%. Sn-3.5Ag-Bi solder bumps were reflowed on BGA (Ball Grid Array) substrates with Au/Ni/Cu UBM (Under Bump Metallization), and their shear strengths were evaluated with the Bi content.…”

Section: Introductionmentioning

confidence: 99%

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Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys

Choi¹,

Cha²,

Oh³

2002

Mater. Trans.

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Mechanical properties and ball shear strength of Sn-3.5Ag-Bi were investigated with Bi addition of 0-9 mass%. Solder characteristics of Sn-3.5Ag-Bi were improved with Bi addition to decrease the melting temperature, to promote wetting to Cu and Ni substrates, and to increase the tensile strength and fracture energy. Shear strength of Sn-3.5Ag-Bi solder bumps increased with Bi addition up to 5 mass%, and was kept almost unchanged with further increase of Bi addition. Shear strength exhibited a parabolic relationship with the tensile fracture energy of the solder alloys.

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“…Firstly, and most importantly it has been demonstrated that Bi additions to Sn-Ag-Cu (SAC) alloys significantly improve their mechanical performance increasing solder joint shear strength [1][2][3][4], thermal fatigue resistance [5] and improving the dropimpact performance [5]. Secondly, Bi additions are shown to improve wetting and spreading performance of lead-free soldering alloys [3,5,6] and to lower their liquidus temperature [7]. Additionally, there are reports available in literature that suggest that Bi additions to SAC solders hinder the growth rate of the Cu3Sn interfacial IMC layer [5,8,9].…”

Section: Introductionmentioning

confidence: 99%

Influence of Bi additions on the distinct βSn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0–4wt%)

Belyakov

Nishimura

Sweatman

et al. 2016

2016 International Conference on Electronics Packaging (ICEP)

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Abstract-Effects of Bi addition to the Ag-containing leadfree solders have been the focus of a considerable amount of past investigations, however, influence of Bi on Sn-Cu-Ni system has not been studied so extensively. In the present study we aimed to reveal the influence of Bi on microstructure formation of Sn-0.7Cu-0.05Ni/Cu solder joints both in the bulk and at the interface. It is shown that (i) Sn-0.7Cu-0.05Ni solidifies to produce a markedly different grain structure to Ag-containing lead-free alloys; (ii) Bi additions to Sn-0.7Cu-0.05Ni had no discernible effect neither on the βSn grain structure nor on (Cu,Ni)6Sn5 interfacial intermetallic layers or primary intermetallic crystals in solder joints.

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Properties of ternary Sn-Ag-Bi solder alloys: Part II—Wettability and mechanical properties analyses

Cited by 101 publications

References 2 publications

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Effect of Bismuth and Silver on the Corrosion Behavior of Lead-free Solders in 3.5 wt% NaCl Solution

Mechanical Properties and Shear Strength of Sn-3.5Ag-Bi Solder Alloys

Influence of Bi additions on the distinct βSn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0–4wt%)

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