Traditional electronic devices are
composed of rigid materials
and components that tend to be unsuitable for soft robotic and stretchable
electronic applications, such as wearable or continuous pressure sensing.
However, deformable materials have the potential to improve upon traditional
devices through enhanced sensitivity and responsiveness, better conformability
and biocompatibility at the human–machine interface, and greater
durability. This work presents deformable composite materials composed
of the gallium–indium–tin alloy galinstan (GaInSn) that
combines the conductivity of a metal and the intrinsic deformability
of a liquid. Dispersing galinstan in an elastomer allows for the formation
of deformable dielectric materials that have tunable mechanical and
electrical behavior, for example, modulus and relative permittivity.
Galinstan composites have been shown previously to have a minimal
modulus impact on the elastomer but concurrently achieve impressive
dielectric performance. However, galinstan dispersions can be costly
and face challenges of mechanical and electrical reliability. Thereby,
this work investigates multimaterial composites composed of galinstan
and a rigid filler, either iron or barium titanate, with respect to
morphology, mechanical behavior, dielectric behavior, and pressure
sensing performance for the purpose of achieving a balance between
a low modulus and superior electrical performance. By combining galinstan
and rigid fillers, it was found that the mechanical and electrical
properties, such as modulus, permittivity, loss behavior, sensitivity,
and linearity of the multimaterial composites can be improved by tuning
filler formulation. This suggests that these dielectric materials
can be used for sensing applications that can be precisely calibrated
to specific material properties and the needs of the user. These deformable
multimaterial composites, found to be stretchable and highly responsive
in sensing applications, will expand the current mechanical abilities
of deformable dielectric materials to improve soft robotic and stretchable
electronic devices.