A thermoplastic material lamination process has various problems of layer deformation, misalignment, and delamination. In particular, Liquid Crystal Polymer (LCP) causes more severe interlayer distortion because it needs a higher lamination temperature than other thermoplastic materials. To solve this, three different types of compression methods were proposed to build an LCP-based 5G patch: Batch (BC), Partial (PC), and Thermal-Partial compression (TPC). The antenna was successfully fabricated using the TPC process showing antenna performance at 28 GHz (low band) and 39 GHz (high band). Furthermore, results proved that circuit alignment of the antenna was influenced by lamination temperature and compression order.