2019
DOI: 10.1002/9781119543343.ch14
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Protective Coatings for SOFC Metallic Interconnects

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Cited by 3 publications
(6 citation statements)
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“…2.54 cm × 2.54 cm × 0.06 cm AISI 430 coupons (MSC Industrial Supply Co. USA) were etched and cleaned. Nickel coating, 4.96 ± 0.28 μm thick, was electrochemically deposited on AISI 430 using sulfamate bath as described in another report [22,23]. Another set of cleaned AISI 430 was coated with Ni-P, 5.24 ± 0.10 μm thick, by a proprietary electroless deposition method (Advanced Technical Finishing, Huntsville, Alabama, USA) in accordance to MIL-C-26074 Class 1.…”
Section: Experimental Methodologymentioning
confidence: 99%
See 1 more Smart Citation
“…2.54 cm × 2.54 cm × 0.06 cm AISI 430 coupons (MSC Industrial Supply Co. USA) were etched and cleaned. Nickel coating, 4.96 ± 0.28 μm thick, was electrochemically deposited on AISI 430 using sulfamate bath as described in another report [22,23]. Another set of cleaned AISI 430 was coated with Ni-P, 5.24 ± 0.10 μm thick, by a proprietary electroless deposition method (Advanced Technical Finishing, Huntsville, Alabama, USA) in accordance to MIL-C-26074 Class 1.…”
Section: Experimental Methodologymentioning
confidence: 99%
“…Nickel-coated (∼15 μm thick) AISI 441 corrodes in simulated dual atmosphere and forms oxide layer with porosity; metallic elements and gap between hematite and spinel layers in an air side and gap between iron oxide and nickel in a fuel side (H 2 -H 2 O) were observed [19]. Nickel coating is also reported to mitigate chromium evaporation of SOFC interconnects in the air side [20,21] and to improve oxidation resistance in humidified air [22,23]. However, the microstructure of nickel-coated SOFC interconnect, the aim of our study, has not been detailed in humidified hydrogen and/or dual environment although interfacial microstructure plays a crucial role for long-term performance.…”
Section: Introductionmentioning
confidence: 99%
“…2.54 cm × 2.54 cm × 0.06 cm AISI 430 coupons (MSC Industrial Supply Co. USA) were etched and cleaned. Nickel coating, 4.96 ± 0.28 μm thick, was electrochemically deposited on AISI 430 using sulfamate bath as described in another report [22,23]. Another set of cleaned AISI 430 was coated with Ni-P, 5.24 ± 0.10 μm thick, by a proprietary electroless deposition method (Advanced Technical Finishing, Huntsville, Alabama, USA) in accordance to MIL-C-26074 Class 1.…”
Section: Experimental Methodologymentioning
confidence: 99%
“…Nickel-coated (∼15 μm thick) AISI 441 corrodes in simulated dual atmosphere and forms oxide layer with porosity; metallic elements and gap between hematite and spinel layers in an air side and gap between iron oxide and nickel in a fuel side (H 2 -H 2 O) were observed [19]. Nickel coating is also reported to mitigate chromium evaporation of SOFC interconnects in the air side [20,21] and to improve oxidation resistance in humidified air [22,23]. However, the microstructure of nickel-coated SOFC interconnect, the aim of our study, has not been detailed in humidified hydrogen and/or dual environment although interfacial microstructure plays a crucial role for long-term performance.…”
Section: Introductionmentioning
confidence: 99%
“…As a plate-type SOFC stack, an interconnect is an intensely significant multifunctional part that associates units with the stack and supplies the fuel gas and oxidant for the anode and cathode, respectively. Over the past few decades, the LaCrO 3 -based ceramic materials have been applied at high temperature (about 1000 °C), but the cost of preparation of the ceramic interconnect is higher than that of the metallic interconnect. , As the SOFC working temperature has been decreased from 1000 to 800 °C or even 600 °C, ceramic materials have been replaced by Cr-based metallic alloys. The Cr-based metallic interconnect has been extensively investigated as a potential candidate interconnect because of its inexpensive cost, excellent electronic conductivity, and exceptional thermal conductivity. , Unfortunately, there are still a considerable number of degradation problems in utilizing the Cr-based metal interconnect, including surface oxidation and Cr evaporation at high temperature, and the surface oxidation of the metallic interconnect obviously increases the contact resistance. , In addition, Cr species evaporating from the interconnect are electrochemically deposited to hinder the oxygen reduction reaction, hence shortening cathode behavior (i.e., chromium poisoning). , …”
Section: Introductionmentioning
confidence: 99%