“…As a plate-type SOFC stack, an interconnect is an intensely significant multifunctional part that associates units with the stack and supplies the fuel gas and oxidant for the anode and cathode, respectively. − Over the past few decades, the LaCrO 3 -based ceramic materials have been applied at high temperature (about 1000 °C), but the cost of preparation of the ceramic interconnect is higher than that of the metallic interconnect. , As the SOFC working temperature has been decreased from 1000 to 800 °C or even 600 °C, ceramic materials have been replaced by Cr-based metallic alloys. The Cr-based metallic interconnect has been extensively investigated as a potential candidate interconnect because of its inexpensive cost, excellent electronic conductivity, and exceptional thermal conductivity. , Unfortunately, there are still a considerable number of degradation problems in utilizing the Cr-based metal interconnect, including surface oxidation and Cr evaporation at high temperature, and the surface oxidation of the metallic interconnect obviously increases the contact resistance. , In addition, Cr species evaporating from the interconnect are electrochemically deposited to hinder the oxygen reduction reaction, hence shortening cathode behavior (i.e., chromium poisoning). , …”