PTI Shared Interconnect in Multi-Chip Package Designs

García, M. Julia Fernández‐Getino; Vallin, Carlos; Enriquez, Raul; Lozoya, Carlos E

doi:10.1109/emcsi.2018.8495290

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI &Amp; PI) 2018

DOI: 10.1109/emcsi.2018.8495290

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PTI Shared Interconnect in Multi-Chip Package Designs

M. Julia Fernández‐Getino García¹,

Carlos Vallin

Raul Enriquez³

et al.

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