2023
DOI: 10.1007/s40194-023-01492-9
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Pulse-pressure diffusion bonding of Ti-6Al-4 V alloy with nanostructured Cu-W multilayer film as interlayer

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(1 citation statement)
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“…AlHazaa et al [19] used the Preferred Reporting Items for Systematic Reviews and Meta-Analyses (PRISMA) methodology to study impulse pressure-assisted diffusion bonding and found that varying the pressure can, indeed, reduce bonding times in diffusion bonding and reduce the requirements for pre-bond surface preparation. Li et al [20] used a novel Cu/W nano-multilayer film and impulse pressure-assisted diffusion bonding to improve the tensile strength of the joint by reducing the formation of brittle compounds during the bonding process. Akhtar et al [21] employed the addition of nanoparticles, which changed the mechanism of the bonding and shortened the period of the process.…”
Section: Introductionmentioning
confidence: 99%
“…AlHazaa et al [19] used the Preferred Reporting Items for Systematic Reviews and Meta-Analyses (PRISMA) methodology to study impulse pressure-assisted diffusion bonding and found that varying the pressure can, indeed, reduce bonding times in diffusion bonding and reduce the requirements for pre-bond surface preparation. Li et al [20] used a novel Cu/W nano-multilayer film and impulse pressure-assisted diffusion bonding to improve the tensile strength of the joint by reducing the formation of brittle compounds during the bonding process. Akhtar et al [21] employed the addition of nanoparticles, which changed the mechanism of the bonding and shortened the period of the process.…”
Section: Introductionmentioning
confidence: 99%