“…[2][3][4][5] Conventional fabrication methods, such as tape casting, allow preparing ceramic packages and film capacitors with different thicknesses (1-3000 μm), but still require high sintering temperatures. 6 In addition, economic considerations limit the use of lower temperature thin film production techniques, such as sol gel, sputtering, chemical vapor deposition, or pulsed laser deposition, 7 due to the slow deposition rate and high levels of residual stress introduced during the fabrication process. 8,9 Therefore, near room-temperature processes, such as cold sintering, 10 cold spraying, 5 and aerosol deposition (AD), 11 have received growing attention.…”