Pumping experiment of water on B and LaB6 films with an electron beam evaporator

Mori, Takahiro; Akaishi, K.; Kubota, Yūsuke; Motojima, O.; Mushiaki, Motoi; Funato, Yasuyuki; Hanaoka, Yutaka

doi:10.1016/0022-3115(93)90314-o

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Fig 1-continued1

Pvd Methods For the Deposition Of Boride Coatings1

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“…However, since stress relaxation is not possible, the highest compressive stresses with values up to 2.7 GPa are reported for this film type (42). Consequently, these high stress levels impose strong requirements on the adhesion strength of the films, which may not be satisfied in every case (6,21,27,28,34,50,51,(55)(56)(57).…”

Section: Fig 1-continuedmentioning

confidence: 88%

“…The application of triode sputtering (30,32,40), dc (4,5,22,33,38,(44)(45)(46)(47)(48)(49)(50)(51)(52)(53)(54)(55)(56)(57)(58)(59)(60)(61) and rf magnetron sputtering (31,(34)(35)(36)(37)(38)(39)(40)(41)(42)(43), electron-beam evaporation (20)(21)(22)(23)(24)(25)(26)(27), and arc evaporation (28,29) for the deposition of boride coatings is reported in the literature. Because of the low electrical and thermal conductivity of boron (22) and because of the high reactivity of certain rare-earth metals with oxygen (e.g., lanthanum and cerium), most PVD processes make use of the corresponding boride as the vapor source in...…”

Section: Pvd Methods For the Deposition Of Boride Coatingsmentioning

confidence: 99%

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