Pure Copper: Advanced Additive Manufacturing

Abstract

This book chapter elaborates on different additive manufacturing (AM) processes of copper and copper alloys. The scope is to give the reader a basic understanding of the state-of-the-art of copper additive manufacturing by different AM technologies, such as laser powder bed fusion (LPBF), laser metal deposition (LMD), binder jetting (BJ), and metal-fused filament fabrication (M-FFF). Furthermore, we want the reader to be able to use this knowledge to find and assess potential use cases. Recently, with the commercial availability of green laser sources, the difficulties for laser processing of pure copper were overcome, which gave AM technologies, such as LPBF and LMD new momentum and increased interest. AM technologies involving a subsequent sintering step. They are relatively new and gained interest due to fast build-up rates (BJ) or ease of operation (M-FFF). We will cover important material-related properties of copper and its implications for manufacturing and application (e.g. absorption, sinterability, conductivity, and its dependency on impurities). Further, we address applications for AM copper, present the state-of-the-art for above mentioned AM technologies and share our own recent research in this field.

Additive Manufacturing of Pure Copper: Technologies and Applications

“…The main advantages of LMD over powder bed-based technologies are the high productivity and flexibility, the ability to work without closed chambers with protected environment, and the possibility to add features to the existing part. Also, machining tools can be integrated into the printing system to enable hybrid manufacturing [39]. The multi-axis configuration allows the construction of threedimensional elements even on non-flat surfaces.…”

“…LMD is not commonly employed to fabricate individual components from pure copper because it cannot provide the dimensional accuracy and resolution usually required for its typical applications (e.g., heat exchangers, inductors, and electromagnetic devices). In addition, the shielding gas can only partially prevent oxidation [39]. Oxides reduce the wettability of molten copper on solid surfaces [40], leading to poor adhesion between the substrate and the built features.…”