Pure copper layer formation on pure copper substrate using multi-beam laser cladding system with blue diode lasers

Hara, Takahiro; Sato, Yuji; Higashino, Ritsuko; Funada, Yoshinori; Ohkubo, Takeru; Morimoto, Keiko; Abe, Nobuyuki; Tsukamoto, Masahiro

doi:10.1007/s00339-020-03559-6

Cited by 37 publications

(8 citation statements)

References 16 publications

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“…Pure copper has excellent electrical and thermal conductivity, high elasticity, high ductility, and good corrosion resistance. Hence, it has been widely used in automobile industry manufacturing, electronic communication, aerospace, and many other fields [ 1 , 2 , 3 ]. Higher demands are placed on the cutting process and the machining quality of pure copper material in the actual machining process.…”

Section: Introductionmentioning

confidence: 99%

Effect of Milling Processing Parameters on the Surface Roughness and Tool Cutting Forces of T2 Pure Copper

Lai

Kun

et al. 2023

Micromachines

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In this paper, the responses of machined surface roughness and milling tool cutting forces under the different milling processing parameters (cutting speed v, feed rate f, and axial cutting depth ap) are experimentally investigated to meet the increasing requirements for the mechanical machining of T2 pure copper. The effects of different milling processing parameters on cutting force and tool displacement acceleration are studied based on orthogonal and single-factor milling experiments. The three-dimensional morphologies of the workpieces are observed, and a white-light topography instrument measures the surface roughness. The results show that the degree of influence on Sa (surface arithmetic mean deviation) and Sq (surface root mean square deviation) from high to low level is the v, the f, and the ap. When v = 600 m/min, ap = 0.5 mm, f = 0.1 mm/r, Sa and Sq are 1.80 μm and 2.25 μm, respectively. The cutting forces in the three directions negatively correlate with increased cutting speed; when v = 600 m/min, Fx reaches its lowest value. In contrast, an increase in the feed rate and the axial cutting depth significantly increases Fx. The tool displacement acceleration amplitudes demonstrate a positive relationship. Variation of the tool displacement acceleration states leads to the different microstructure of the machined surfaces. Therefore, selecting the appropriate milling processing parameters has a positive effect on reducing the tool displacement acceleration, improving the machined surface quality of T2 pure copper, and extending the tool’s life. The optimal milling processing parameters in this paper are the v = 600 m/min, ap = 0.5 mm, and f = 0.1 mm/r.

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Section: Introductionmentioning

confidence: 99%

Effect of Milling Processing Parameters on the Surface Roughness and Tool Cutting Forces of T2 Pure Copper

Lai

Kun

et al. 2023

Micromachines

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“…High-precision pure copper substrates and wafers are indispensable materials for precision physical experiments and ultra-large-scale integration (ULSI) because of their excellent electrical conductivity and other physical properties [1,2]. As a difficult-to-cut material, there are many problems in using traditional processing methods [3].…”

Section: Introductionmentioning

confidence: 99%

Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping

Guo

Pan

et al. 2023

Chin. J. Mech. Eng.

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Double-sided lapping is an precision machining method capable of obtaining high-precision surface. However, during the lapping process of thin pure copper substrate, the workpiece will be warped due to the influence of residual stress, including the machining stress and initial residual stress, which will deteriorate the flatness of the workpiece and ultimately affect the performance of components. In this study, finite element method (FEM) was adopted to study the effect of residual stress-related on the deformation of pure copper substrate during double-sided lapping. Considering the initial residual stress of the workpiece, the stress caused by the lapping and their distribution characteristics, a prediction model was proposed for simulating workpiece machining deformation in lapping process by measuring the material removal rate of the upper and lower surfaces of the workpiece under the corresponding parameters. The results showed that the primary cause of the warping deformation of the workpiece in the double-sided lapping is the redistribution of initial residual stress caused by uneven material removal on the both surfaces. The finite element simulation results were in good agreement with the experimental results.

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“…And it was reported that the temperature dependence of the absorptivity of pure copper for blue laser is lower than that of the IR laser [5]. Because of these advantages, some researchers have reported the effectiveness of blue laser on pure copper processing [6,7,8]. On the other hands, the beam quality of blue diode laser is currently inferior to that of the IR laser.…”

Section: Introductionmentioning

confidence: 99%

Observation of melt pool dynamics in pure copper welding with blue-IR hybrid laser

Fujio

Sudo

Takenaka

et al. 2023

Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVIII

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A bead on plate welding test of pure copper plate was conducted with a hybrid laser which combined a high-power infrared (IR) laser and a blue laser to achieve a deep penetration and spatter-less welding of pure copper. A 1.5 kW class IR laser which has the wavelength around 1000 nm and a 1.5 kW class blue diode laser which has the wavelength of 450 nm were used as a heat source. The IR laser and the blue diode laser were irradiated perpendicular to the sample at the angles of 0° and 45°, respectively. Each laser was focused onto 2 mm thick pure copper sample and combined on the surface of it as a hybrid laser. The hybrid laser was scanned on the sample at 100 mm/s varying the output power of the IR laser and the blue diode laser. While scanning the lasers, the dynamics of melt pool formation and the spatters were observed with a high-speed video camera. After laser irradiation, the cross-section of the sample was observed and the penetration depth of the bead was measured. As the results, it was found that the penetration depth of pure copper increased and the number of spatters generated per scanning length decreased with the increase of blue laser intensity. Also, it was clarified that the melt pool dynamics affects the amount of spatter generated during welding.

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Pure copper layer formation on pure copper substrate using multi-beam laser cladding system with blue diode lasers

Cited by 37 publications

References 16 publications

Effect of Milling Processing Parameters on the Surface Roughness and Tool Cutting Forces of T2 Pure Copper

Effect of Milling Processing Parameters on the Surface Roughness and Tool Cutting Forces of T2 Pure Copper

Stress-Induced Deformation of Thin Copper Substrate in Double-Sided Lapping

Observation of melt pool dynamics in pure copper welding with blue-IR hybrid laser

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