Investigation on thermal properties, required for various design considerations, have recently emerged as a key issue in functional ceramics and ceramic composites. This issue of Advances in Applied Ceramics presents a selection of papers on thermal properties and processing, which were discussed at the 10th Asian Thermophysical Properties Conference (ATPC). ATPC took place from 29th September to 3rd October 2013, in Jeju, Korea. The main themes of the conference were; thermodynamic properties, transport properties, optical and thermal radiative properties, thermoelectric properties and materials. Particularly, thermal expansion coefficients, thermal conductivity, as well as high-temperature strength and phase stability are deemed as important factors for the high-temperature application of ceramics. The six papers selected for this special issue represent current research trends and applications in the field.