2021
DOI: 10.1117/1.jmm.20.3.031013
|View full text |Cite
|
Sign up to set email alerts
|

Pushing the limits of EUV mask repair: addressing sub-10 nm defects with the next generation e-beam-based mask repair tool

Abstract: Mask repair is an essential step in the manufacturing process of extreme ultraviolet (EUV) masks. Its key challenge is to continuously improve resolution and control to enable the repair of the ever-shrinking feature sizes on mask along the EUV roadmap. The state-of-the-art mask repair method is gas-assisted electron-beam (e-beam) lithography also referred to as focused electron-beam induced processing (FEBIP). We discuss the principles of the FEBIP repair process, along with the criteria to evaluate the repai… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
6
0

Year Published

2022
2022
2023
2023

Publication Types

Select...
3
2

Relationship

1
4

Authors

Journals

citations
Cited by 6 publications
(6 citation statements)
references
References 30 publications
0
6
0
Order By: Relevance
“…During the processing of masks, certain amounts of defects can be produced, which then requires the defect repair and inspection. Currently, the EUV mask relies on electron beam induced deposition and etching (EBID/EBIE) due to shrinking feature sizes 21 . With new APSM absorber material, the corresponding repair material should also satisfy the optical criteria, while this requires the selection of precursor molecules that can produce precise additive deposition and substrative etching to repair the mask.…”
Section: Process Challengesmentioning
confidence: 99%
“…During the processing of masks, certain amounts of defects can be produced, which then requires the defect repair and inspection. Currently, the EUV mask relies on electron beam induced deposition and etching (EBID/EBIE) due to shrinking feature sizes 21 . With new APSM absorber material, the corresponding repair material should also satisfy the optical criteria, while this requires the selection of precursor molecules that can produce precise additive deposition and substrative etching to repair the mask.…”
Section: Process Challengesmentioning
confidence: 99%
“…The stringent demands for defect-free reflective photomasks in particular present challenges to its widespread adoption. Nevertheless, with anticipated technological advances aiming to enhance simplicity and reduce costs in these systems, the resolution remains advantageous for biomedical applications such as nanofluidics [ 116 , 117 ].…”
Section: Conventional Lithographic Techniquesmentioning
confidence: 99%
“…In recent work, the Zeiss AIMS ® EUV was successfully used to qualify the effective repair of programmed 2.25 nm (1x) extrusions for a P44 L/S 1:1 pattern. 8 Despite the effective repair, it was not clear whether that extrusion would have led to a defect at wafer level and whether repair was needed after all.…”
Section: Introductionmentioning
confidence: 99%