Quad driver for GaN transistors based dual active bridge with capacitive coupling

Sarrafin_ardebili, Farshid; Crébier, Jean-Christophe; Allard, Bruno

doi:10.1109/icit.2018.8352391

Cited by 1 publication

(1 citation statement)

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“…Integration is used to increase reliability by relying on advanced and collective manufacturing platforms. In such a way, monolithic integration can be used to aggregate all active parts, including if possible, power transistors in a single device to reduce interconnects and assembly issues [11]. Hybrid integration is considered for the assembly of heterogeneous components in conversion sub modules such as Integrated Power Electronics Modules (IPEM) [12] for the same benefits.…”

Section: Introductionmentioning

confidence: 99%

Impact of Component Dispersion in DC to DC Low-Power Low-Voltage Power Converter Array

et al. 2019

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The paper deals with arrays of numerous power conversion cells, associated in series and/or in parallel to build larger step up or step down direct current (DC)/DC isolated converters. The work focuses on the impact of the spread and distribution of the conversion cell characteristics on the characteristics and performance of the power converter array (PCA). Based on a characterization protocol, about 130 conversion standard cells (CSC) are characterized and classified from a statistical point of view. Three families are defined and representatives are chosen and implemented in various configurations, in open and closed loop control, to analyze the impact of their spread characteristic over the global converter, the PCA. The paper is based on an extended practical set up and protocols, all described in details. Guidelines on CSCs implementation with respect to their dispersion are provided at the end on the paper.

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Section: Introductionmentioning

confidence: 99%