2022
DOI: 10.3390/ma15072402
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Quad-Level Cell Switching with Excellent Reliability in TiN/AlOx:Ti/TaOx/TiN Memory Device

Abstract: TiN/AlOx:Ti/TaOx/TiN memory devices using bilayer resistive switching memory demonstrated excellent durability and capability of QLC (quad-level cell) memory devices. The best nonvolatile memory characteristics with the lowest operation current and optimized 4 bit/cell states were obtained using the Incremental Step Pulse Programming (ISPP) algorithm in array. As a result, a superior QLC reliability (cycle endurance > 1 k at each level of the QLC, data retention > 2 h at 125 °C) for all the 4 bits/cell o… Show more

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“…This analysis indicates that TiON was formed between the HfO x and TiN layers. The set behavior occurring in the negative region was also formed by this TiON layer, which can perform a gradual set operation by acting as an oxygen reservoir [ 51 , 52 ].
Fig.
…”
Section: Resultsmentioning
confidence: 99%
“…This analysis indicates that TiON was formed between the HfO x and TiN layers. The set behavior occurring in the negative region was also formed by this TiON layer, which can perform a gradual set operation by acting as an oxygen reservoir [ 51 , 52 ].
Fig.
…”
Section: Resultsmentioning
confidence: 99%