“…Solid additive is an emerging approach to solve this problem. [ 48–52 ] The solid additive presents during the solution‐casting process of the photoactive layer to manipulate the molecular stacking and structural ordering, [ 53,54 ] but the temperatures to drive them evaporating from the solid active layer are usually moderate around 100 °C, making them ideal materials to prepare high‐performance additive‐free OSCs, although their volatility is not essential toward performance improvement. [ 49,53,55 ] For example, SA‐4, a solid additive synthesized by Yu et al., could regulate the ordered arrangement and π‐π stacking of NFA molecules, increasing the PCE of poly[(2,6‐(4,8‐bis(5‐(2‐ethylhexyl‐3‐chloro)thiophen‐2‐yl)‐benzo[1,2‐b:4,5‐b′]dithiophene))‐alt‐(5,5‐(1′,3′‐di‐2‐thienyl‐5′,7′‐bis(2‐ethylhexyl)benzo[1′,2′‐c:4′,5′‐c′]dithiophene‐4,8‐dione)] (PBDB‐T‐2Cl or PM7):9‐Bis(2‐methylene‐((3‐(1,1‐dicyanomethylene)‐6,7‐difluoro)‐indanone))‐5,5,11,11‐tetrakis(4‐hexylphenyl)‐dithieno2,3‐d:2′,3′‐d′‐s‐indaceno1,2‐b:5,6‐b′dithiophene (IT‐4F) OSCs from 12.1% to 13.5%.…”