Qualitative and Quantitative Microstructural Analysis of Copper for Sintering Process Optimization in Additive Manufacturing Applications

Ott, J.; Burghardt, Andreas; Britz, Dominik; Majauskaite, S.; Mücklich, Frank

doi:10.1515/pm-2020-0002

Cited by 3 publications

(1 citation statement)

References 10 publications

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“…The surface observation was carried out to know the existence of inhomogeneities such as cracks, large pores, pore agglomeration, and layer delamination (exclusive only for Binder Jetting) [41]. The surface observation on the final product (Figure 6) revealed the existence of a defect in the form of pores (pointed to by arrows), as well as pore agglomeration (marked in the dashed circles).…”

Section: Surface Observationmentioning

confidence: 99%

Moldflow Simulation and Characterization of Pure Copper Fabricated via Metal Injection Molding

et al. 2023

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Metal injection molding (MIM) is a representative near-net-shape manufacturing process that fabricates advanced geometrical components for automobile and device industries. As the mechanical performance of an MIM product is affected by green-part characteristics, this work investigated the green part of pure copper processed with MIM using the injection temperature of ~180 °C and injection pressure of ~5 MPa. A computational analysis based on the Moldflow program was proposed to simulate the effectivity of the process by evaluating the confidence of fill, quality prediction, and pressure drop of three distinctive regions in the green part. The results showed that the ring and edge regions of the green parts showed localized behavior, which was related to processing parameters including the position of the gate. A microstructural observation using scanning electron microscopy and a 3D X-ray revealed that both the surface and body matrix consisted of pores with some agglomeration of micro-pores on the edges and ring part, while any critical defects, such as a crack, were not found. A microhardness analysis showed that the three regions exhibited a reasonable uniformity with a slight difference in one specific part mainly due to the localized pore agglomeration. The simulation results showed a good agreement with the microstructures and microhardness data. Thus, the present results are useful for providing guidelines for the sound condition of MIM-treated pure copper with a complex shape.

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Section: Surface Observationmentioning

confidence: 99%

Moldflow Simulation and Characterization of Pure Copper Fabricated via Metal Injection Molding

et al. 2023

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Microstructural analysis as a requirement for sinter-based additive manufacturing of highly conductive copper

Ott

Burghardt

Britz

et al. 2022

Practical Metallography

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To further improve the range of battery-powered electric vehicles, new concepts in power electronics are required. The use of so-called “wide-bandgap” semiconductor materials, such as SiC, could meet the need for even more powerful power electronics, but this also increases the demands on the thermal management of the components. Complex copper cooler structures adapted to the temperature field could be a suitable way to meet these increasing requirements for heat dissipation. However, conventional manufacturing techniques such as forging, casting and milling are reaching their limits for the production of complex Cu structures, and new processes such as additive manufacturing are coming into focus. Additive manufacturing processes such as selective laser melting (SLM) place high demands on the laser system for highly-conductive copper (Cu) [1]. This means that less established sinter-based processes such as binder jetting (BJ) or fused filament fabrication (FFF) are also suitable for the production of complex Cu structures. In sinter-based methods, the sintering process and the microstructure, which is strongly influenced by it, is crucial for achieving good physical properties of the component [2]. In this work, methods are presented that allow for a quantitative and qualitative evaluation of the sintering process of copper at the microstructure level in order to derive optimized process parameters that enable higher sintering densities and thus greater conductivities. The influence of residual porosity and impurities on conductivity was investigated and allows for a specific prediction of the expected conductivity of sintered Cu structures.

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Calculation of Different Intensity Ratios of Samples with Atomic Numbers between 9≤Z≤83 Using the Dilution Technique

akkus,

Yılmaz,

TEMİZ

2024

Preprint

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Qualitative and Quantitative Microstructural Analysis of Copper for Sintering Process Optimization in Additive Manufacturing Applications

Cited by 3 publications

References 10 publications

Moldflow Simulation and Characterization of Pure Copper Fabricated via Metal Injection Molding

Moldflow Simulation and Characterization of Pure Copper Fabricated via Metal Injection Molding

Microstructural analysis as a requirement for sinter-based additive manufacturing of highly conductive copper

Calculation of Different Intensity Ratios of Samples with Atomic Numbers between 9≤Z≤83 Using the Dilution Technique

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