Quantitative analyses of Ag3Sn intermetallic compound formation in SnAgCu solder alloys

Garami, Tamas; Krammer, Olivér

doi:10.1007/s10854-015-3526-x

Cited by 12 publications

(8 citation statements)

References 28 publications

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“…However, during both storage and service, the microstructure of the SnAgCu solder joints, consisting of β-Sn rich zones, Ag 3 Sn, and Cu 6 Sn 5 compounds, is susceptible to coarsen over time [9]. The resulting large Ag 3 Sn particles tend to weaken the mechanical properties of solder joints, thereby degrading their thermal fatigue lifetime [10,11]. It is worth noting that coarsening impacts of Ag 3 Sn compounds on the mechanical properties are much greater, relative to Cu 6 Sn 5 compounds, owing to their higher volume proportion in the solder joint [12,13].…”

Section: Introductionmentioning

confidence: 99%

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints

et al. 2018

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As solder joints are being scaled down, intermetallic compounds (IMCs) are playing an increasingly critical role in the reliability of solder joints, and thereby an in-depth understanding of IMCs microstructure evolutions in micro-joints is of great significance. This study focused on coarsening behaviors of Ag3Sn compounds in Sn-3.0Ag-0.5Cu (SAC305) micro-joints of flip chip assemblies using thermal shock (TS) tests. The results showed that the Ag3Sn compounds grew and rapidly coarsened into larger ones as TS cycles increased. Compared with such coarsening behaviors during thermal aging, TS exhibited a significantly accelerating influence. This predominant contribution is quantitatively determined to be induced by strain-enhanced aging. Moreover, based on observations for Ag3Sn microstructure evolutions during TS cycling, one particular finding showed that there are two types of coarsening modes (i.e., Ostwald ripening and Necking coalescence) co-existing in the Ag3Sn coarsening process. The corresponding evolutions mechanism was elucidated in a combination of simulative analysis and experimental validation. Furthermore, a kinetic model of the Ag3Sn coarsening was established incorporating static aging and strain-enhanced aging constant, the growth exponent (n) was calculated to be 1.70, and the predominant coarsening mode was confirmed to be the necking coalescence.

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Section: Introductionmentioning

confidence: 99%

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints

et al. 2018

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“…It is been reported elsewhere that the large Ag 3 Sn are dependent on the cooling rate and the formation of large Ag 3 Sn plates could form at a relatively slow cooling rate. 16,17 Moreover, previous studies found that the size of Ag 3 Sn could be influenced by the growth of velocity and amount of Ag element remaining in solder before solidification takes place. 18,19 In our experiment, at 0.33°C/s cooling rate, large Ag 3 Sn crystal were not observed.…”

Section: Microstructure Analysis Of Sn-35ag Solder Jointsmentioning

confidence: 99%

Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties

Amli

Salleh

Ramli

et al. 2020

Journal of Elec Materi

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This study examines factor(s) behind the formation of primary Cu 6 Sn 5 (in the bulk, rather than at the interface) in solder joints, even though solder alloys are hypoeutectic. To understand the contribution from copper (Cu) dissolution from the substrate a Cu-free alloy, tin-3.5 silver (Sn-3.5Ag), was used as a soldered-on copper organic solderability preservative (Cu-OSP) and electroless nickel immersion gold (ENIG) surface finish substrates. Microstructure observations including in situ synchrotron were used to observe microstructure development real-time and confirm the time and location for nucleation of primary Cu 6 Sn 5 . High-speed shear tests were performed to determine the solder joint's strengths. The results confirm that Cu dissolution during soldering is responsible for the formation of primary Cu 6 Sn 5 . The ENIG finish prevented Cu dissolution and the formation of Cu 6 Sn 5 resulting in higher solder joint strength for the Sn-3.5Ag/ENIG solder joints. The findings can be used to understand the evolution of primary Cu 6 Sn 5 and how it can be suppressed to improve joint strength.

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“…Thus, we developed a method and performed research about optimizing CT measurement parameters. In the experiment, cracks were formed inside SAC (SnAgCu) solder joints intentionally by aging the joints with TS test (-40 to +140 °C, 2 000 cycles) [59], and CT images were captured about them with different rotational increment (1/4, 1/2 and 1°) of sample projection (Fig. 4).…”

Section: Micro-and Nano-scale Materials Characterizationmentioning

confidence: 99%

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2016

Charaf

Harsányi

Poppe

et al. 2017

Period. Polytech. Elec. Eng. Comp. Sci.

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Preface Since being established in 1949, the Faculty of Electrical Engineering and Informatics (VIK) BME has played a flagship role in the development of electronics, IT and computer science in Hungary.We László Jakab (dean, BME VIK) János Levendovszky (vice-dean in charge of scientific affairs, BME VIK) are proud of combining engineering applications with sound scientific results, which is the assurance of high-level industrial collaboration leading to novel results and innovation. The various collaborations with our industrial partners has made it clear that the industry expects methods and results which make their industrial processes more effective and increase productivity and quality. Thus, participation in these collaborations give a competitive edge and ensure the continuous development of VIK. These factors have positioned our Department of Automation and Applied InformaticsDepartment of Automation and Applied Informatics (AUT) is one of the largest and dynamically developing departments at BME with diverse scope competences such as control theory, embedded systems, software modelling, applied software development, Internet of Things, power electronics, mechatronics, and many others. The department's main activities are education, research and development. Training versatile electrical and software engineers with solid practical knowledge is our top priority. Our profile also includes developing high quality software and hardware solutions for industry partners. All of our activities are backed by strong research background.In 2016, the department organized and hosted a number of domestic and international events. In cooperation with the industry, AUT has organized the IoT4U conference. It was dedicated to Internet of Things, cloud and data management as well as the integration of IoT into various formats. RobonAUT, the yearly domestic amateur robotics contest was organized by the department in February 2016. The yearly contest is open to teams of students, organized either in student projects within the department or independent research teams.The next sections summarize the key research results of the department in year 2016. Software Development Methods and Mobile PlatformsThe diversity of mobile platforms necessitates the development of the same mobile application for all major mobile platforms, what requires considerable development effort. Mobile application developers are multiplatform developers, but they still prioritize the platforms, therefore, not all platforms are equally important for them. Appropriate methods, processes and tools are required to support the development in order to achieve better productivity.The research on educational mobile applications that adapt to the mental state of the user required a method for estimating the difficulty of tasks found in the serious games. There are generated or random assignments where the effort required from the user is not known or cannot be estimated in advance.61 (2) IoT and Smart CityThe Internet of Things (IoT) is transforming the surroun...

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Quantitative analyses of Ag3Sn intermetallic compound formation in SnAgCu solder alloys

Cited by 12 publications

References 28 publications

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints

Ag3Sn Compounds Coarsening Behaviors in Micro-Joints

Origin of Primary Cu6Sn5 in Hypoeutectic Solder Alloys and a Method of Suppression to Improve Mechanical Properties

BME VIK Annual Research Report on Electrical Engineering and Computer Science 2016

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