Quantitative analysis of the phase-separated structure and mechanical properties of acrylic copolymer/epoxy thermosetting resin composites

Herein, a temperature‐responsive nanoemulsion film (NEF) system is introduced with spinodal decomposition for in situ thermoset curing. The NEFs, fabricated by alternate layering of nanoemulsion droplets with bacterial cellulose nanofibrils (BCFs) and polyelectrolytes through the layer‐by‐layer (LbL) deposition, show ≈32% increase in Young's modulus compared with those fabricated with polyelectrolytes only. It is determined that such reinforcement stemmed from the presence of BCFs that form fibrillary layers in the NEF matrix. The BCF‐reinforced NEFs show the unprecedented spinodal decomposition behavior; nanoemulsion droplets uniformly dispersed in the NEF network and readily interdiffused to produce microscale oil domains with controlled phase separation rate as well as oil domain size. The insight gained from the thin film‐based microphase separation behavior confirms that NEFs layered with epoxy resin nanoemulsions are materials with promising temperature‐responsive in situ thermoset curing performance.

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Unveiling Spinodal Decomposition‐Driven Phase Separation of Cellulose Nanofibrils‐Reinforced Nanoemulsion Films for In Situ Thermoset Curing

Park

Seo

Lee

et al. 2020

Adv Materials Inter

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Curing Kinetics and the Properties of KH560-SiO2/Polyethersulfone/Bismaleimide-Phenolic Epoxy Resin Composite

Chen

Geng

et al. 2019

J Inorg Organomet Polym

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The effect of Cu nanoparticle adding on to epoxy-based adhesive and adhesion properties

Ataberk

2020

Sci Rep

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Epoxy-based adhesives are widely used for repairing or jointing the metal sheets in the industry. Because of their superior mechanical properties, the metallic nanoparticles can be selected as the additive of the epoxy adhesive. The strength of the Cu nanoparticles (CuNPs) can be expected to improve the mechanical properties of neat epoxy. In this study, CuNPs were added at various weight ratios, such as 1, 2, 5, 10, 15, and 20% into the epoxy resin adhesive. Tensile tests of the dog-bone specimens and the lap-shear tensile tests of the single lap joints were performed for obtaining the mechanical properties. In order to investigate the failure mechanisms, the fractured surfaces of the tensile test samples and adhesively joined sheets were imaged by using a Scanning Electron Microscope. The thermal properties of the adhesives were obtained by using Thermo Gravimetric Analysis and Differential Thermal Analysis. The mechanical and thermal properties of epoxy resin adhesive were improved by adding the CuNPs. The best adding ratios of CuNPs into epoxy were obtained by both mechanical and thermally point of views. As a result of this study, 15 wt% the ratio of Cu nanoparticle adding into the epoxy-based adhesive is suitable for improving the mechanical properties. On the other hand, 20% is the proper Cu nanoparticle adding ratio for the thermal properties improving.

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Quantitative analysis of the phase-separated structure and mechanical properties of acrylic copolymer/epoxy thermosetting resin composites

Cited by 4 publications

References 18 publications

Unveiling Spinodal Decomposition‐Driven Phase Separation of Cellulose Nanofibrils‐Reinforced Nanoemulsion Films for In Situ Thermoset Curing

Unveiling Spinodal Decomposition‐Driven Phase Separation of Cellulose Nanofibrils‐Reinforced Nanoemulsion Films for In Situ Thermoset Curing

Curing Kinetics and the Properties of KH560-SiO2/Polyethersulfone/Bismaleimide-Phenolic Epoxy Resin Composite

The effect of Cu nanoparticle adding on to epoxy-based adhesive and adhesion properties

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