Quantitative determination of a subsurface defect of reference specimen by lock-in infrared thermography

Choi, Moon‐Hee; Kang, Ki Soo; Park, Jeonghak; Kim, Wontae; Kim, Koungsuk

doi:10.1016/j.ndteint.2007.08.006

Cited by 83 publications

(73 citation statements)

References 7 publications

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“…where q is the rate of energy emission (W), A is the area of emitting surface (m heating, lock-in, vibrothermography and pulsed phase thermography [6][7][8][9][10][11][12][13][14].…”

Section: Theorymentioning

confidence: 99%

Detection of Subsurface Defects in Metal Materials Using Infrared Thermography; Image Processing and Finite Element Modeling

Shrestha¹,

Kim²

2014

Journal of the Korean Society for Nondestructive Testing

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Infrared thermography is an emerging approach to non-contact, non-intrusive, and non-destructive inspection of various solid materials such as metals, composites, and semiconductors for industrial and research interests. In this study, data processing was applied to infrared thermography measurements to detect defects in metals that were widely used in industrial fields. When analyzing experimental data from infrared thermographic testing, raw images were often not appropriate. Thus, various data analysis methods were used at the pre-processing and processing levels in data processing programs for quantitative analysis of defect detection and characterization; these increased the infrared non-destructive testing capabilities since subtle defects signature became apparent. A 3D finite element simulation was performed to verify and analyze the data obtained from both the experiment and the image processing techniques.

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“…where q is the rate of energy emission (W), A is the area of emitting surface (m heating, lock-in, vibrothermography and pulsed phase thermography [6][7][8][9][10][11][12][13][14].…”

Section: Theorymentioning

confidence: 99%

Detection of Subsurface Defects in Metal Materials Using Infrared Thermography; Image Processing and Finite Element Modeling

Shrestha¹,

Kim²

2014

Journal of the Korean Society for Nondestructive Testing

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“…Pulsed, lock-in and pulse-phase thermography techniques are among the most common active infrared thermography techniques [7][8][9][10]. These active infrared techniques use external heat sources such as halogen lamps to create thermal waves through the target structures, and identify defects by examining differences in heat transfer characteristics between defect and intact areas.…”

Section: Introductionmentioning

confidence: 99%

Active Infrared Thermography for Visualizing Subsurface Micro Voids in an Epoxy Molding Compound

Yang¹,

Hwang²,

Choi³

et al. 2017

Journal of the Korean Society for Nondestructive Testing

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This paper presents an automated subsurface micro void detection technique based on pulsed infrared thermography for inspecting epoxy molding compounds (EMC) used in electronic device packaging. Subsurface micro voids are first detected and visualized by extracting a lock-in amplitude image from raw thermal images. Binary imaging follows to achieve better visualization of subsurface micro voids. A median filter is then applied for removing sparse noise components. The performance of the proposed technique is tested using 36 EMC samples, which have subsurface (below 150 µm~ 300 µm from the inspection surface) micro voids (150 µm ~ 300 µm in diameter). The experimental results show that the subsurface micro voids can be successfully detected without causing any damage to the EMC samples, making it suitable for automated online inspection.

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“…The effectiveness of IR thermography in detecting subsurface defect in metallic components has widely been validated in many studies [10][11][12]. However, defects usually present weak indications in thermograms.…”

Section: Introductionmentioning

confidence: 99%

Sizing Subsurface Defects in Metallic Plates by Square Pulse Thermography Using an Oriented Gradient Map

Xie

Gong

et al. 2016

Applied Sciences

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Abstract:We developed a new approach for sizing subsurface defects in the square pulse thermography of metallic plates by employing the oriented gradient of histograms. To size defects with high accuracies is still a challenge in infrared (IR) thermography today. Especially for blurry defects, accurate sizing of them is difficult with existing methods. The oriented gradient of histograms, which is used in the successful probability of boundary (Pb) contour detector in natural image processing literature, is employed in this work to improve the sizing accuracy in square pulse thermography. Experiments on a corroded steel plate with flat blind holes have verified the effectiveness of the proposed approach to size defects. Experimental results show that the proposed approach can size distinct and blurry defects with high accuracies. Comparison research is also implemented between the proposed approach and other sizing methods. The comparison results show that the proposed approach is superior to existing methods.

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Quantitative determination of a subsurface defect of reference specimen by lock-in infrared thermography

Cited by 83 publications

References 7 publications

Detection of Subsurface Defects in Metal Materials Using Infrared Thermography; Image Processing and Finite Element Modeling

Detection of Subsurface Defects in Metal Materials Using Infrared Thermography; Image Processing and Finite Element Modeling

Active Infrared Thermography for Visualizing Subsurface Micro Voids in an Epoxy Molding Compound

Sizing Subsurface Defects in Metallic Plates by Square Pulse Thermography Using an Oriented Gradient Map

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