Quasi-in-situ observation of the grain growth and grain boundary movement in sintered Cu nanoparticle interconnects

Zuo, Yang; Zhao, Tianshou; Robador, Ana; Wickham, M; Mannan, Samjid H.

doi:10.1016/j.actamat.2022.118135

Cited by 24 publications

(3 citation statements)

References 36 publications

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“…The mean values of the ultimate resistivity of five specimens for each heating condition were calculated. The description of porosity measurement is the same as the previously reported method in the literature …”

Section: Methodsmentioning

confidence: 99%

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Novel Cu@Ag Micro/Nanoparticle Hybrid Paste and Its Rapid Sintering Technique via Electromagnetic Induction for High-Power Electronics

Liu

Feng

et al. 2023

ACS Omega

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Due to the harsh working environments up to 600 °C, the exploration of high-temperature interconnection materials is significantly important for high-power devices. In this study, a hybrid paste including Cu@Ag core–shell microparticles (MPs) and Ag nanoparticles (NPs) was designed to achieve Cu–Cu bonding. The Cu@Ag MPs exhibited excellent oxidation stability in an air atmosphere with the Ag layer coating on the Cu core. Ag NPs fill the pores among the Cu@Ag MPs and reduce the sintering temperature of the hybrid paste. The Cu–hybrid paste–Cu joints were formed via electromagnetic induction heating within approximately 15 s. When sintered at 26 kW, the shear strength of the joint reached 48 MPa, the porosity decreased to 0.73%, and the resistivity was down to 13.25 μΩ·cm. Furthermore, a possible interconnection mechanism at the contact interface between the Cu substrate and the sintered hybrid paste was proposed, which is related to the melting point of metal particles and the effect of magnetic eddy currents. This fast bonding technology inspires a new approach to interconnection for high-power devices under high operation temperatures.

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Section: Methodsmentioning

confidence: 99%

“…The description of porosity measurement is the same as the previously reported method in the literature. 27 …”

Section: Methodsmentioning

confidence: 99%

Novel Cu@Ag Micro/Nanoparticle Hybrid Paste and Its Rapid Sintering Technique via Electromagnetic Induction for High-Power Electronics

Liu

Feng

et al. 2023

ACS Omega

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show abstract

“…Sintering of Cu nanoparticles has an oxidation issue and this could reduce the joint reliability [5]. Cu nanoparticles have been widely studied as a die attach interconnection material due to their comparable conductivity to Ag but high abundance and electro-chemical migration resistance [6][7][8][9][10][11]. Acid pre-treatment followed by inert gas sintering is a popular way to remove the original oxide and suppress the oxide formation during the sintering process.…”

Section: Introductionmentioning

confidence: 99%

In Situ Reduction-Sintering to Produce Copper Interconnects for High Temperature Electronics

Zuo,

Mannan

2023

IMAPSource Proceedings

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This study presents a special in situ reduction-sintering of CuO and Cu nanoparticles. The microstructure and strength of sintered Cu joints by CuO and Cu nanoparticle were compared. The reduced Cu particles of CuO have a larger size of 1 μm and lower sinterability which results in an insufficient sintering of Cu. In contrast, the sintered Cu nanoparticle structure shows a strong bonding of Cu and plastic deformation after fracture. Owing to the removal of the original oxide and limitation of its re-appearing during sintering by the proposed method, high sintered Cu joint strength over 30 MPa was achieved without the need for pressurized sintering or protective gas atmospheres.

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Shape Synergy of Ag@Cu Chip Packaging Nano‐Paste and Its Sintering Reliability

Yin,

Guo,

Zhao

et al. 2024

Adv Eng Mater

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Electrochemical migration of Ag can result in failure of power chips, thus affecting the application of nano‐Ag paste as packaging material. In this study, a novel sintered material is developed using shape‐synergistic Ag‐coated Cu (Ag@Cu) particles, aiming at establishing a highly reliable connection between the chips and the substrates. The sintering behavior of Ag@Cu particles is examined, elucidating the role of skeleton‐wetting synergism in enhancing the strength of the sintered layer from a structural perspective. Two distinct shapes of Ag@Cu particles serve as a skeleton support, providing electrical conductivity, and nano‐Ag particles enhance wettability. Ag as a coating layer can slow down the oxidation of Cu, despite that oxidation still occurs in the sintered layer during the high‐temperature tests, initially weakening the strength of the sintered layer, but eventually stabilization is achieved. The presence of Cu effectively inhibits electrochemical migration of Ag. The reliability of the sintered layer is enhanced by the novel shape of Ag@Cu particles and the interaction between Ag and Cu, thereby ensuring the stability of the power chips.

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Quasi-in-situ observation of the grain growth and grain boundary movement in sintered Cu nanoparticle interconnects

Cited by 24 publications

References 36 publications

Novel Cu@Ag Micro/Nanoparticle Hybrid Paste and Its Rapid Sintering Technique via Electromagnetic Induction for High-Power Electronics

Novel Cu@Ag Micro/Nanoparticle Hybrid Paste and Its Rapid Sintering Technique via Electromagnetic Induction for High-Power Electronics

In Situ Reduction-Sintering to Produce Copper Interconnects for High Temperature Electronics

Shape Synergy of Ag@Cu Chip Packaging Nano‐Paste and Its Sintering Reliability

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