Quasistatic frictional thermo‐piezoelectric contact problem

Abstract

We consider here a mathematical model describing the bilateral frictional contact between a thermo‐piezoelectric body and a thermally conductive foundation. We model the behavior of the material with a linear thermo‐electro‐elastic constitutive law. The process is assumed to be quasistatic and the contact is modeled with a nonlocal version of Coulomb's dry friction law, in which the frictional heat generated in the process, is taken into account. We drive a variational formulation of the problem and establish the existence of its weak solution.

Examining the contact problem of a functionally graded layer supported by an elastic half‐plane with the analytical and numerical methods

“…In Figures (6)(7)(8)(9), the contact stress variations are shown for different values of the end distance of the distributed load (a 2 /h), the start distance of the distributed load (a 1 /h), and the non-homogeneity parameter (β). As can be seen from Figures 6 and 7, the non-homogeneity parameter (β) increases, and the contact stresses (p 1 (x)/p 0 ) decrease in the regions close to the symmetry axis and increase as they approach the point where the contact ends.…”

“…In addition to these two methods, there are also problems created with layers containing FGM. For this reason, contact problems examined using analytical and numerical analysis methods in the literature occupy an extensive area [9][10][11][12][13][14][15][16].…”

Continuous and discontinuous contact problem of a functionally graded orthotropic layer indented by a rigid cylindrical punch: Analytical and finite element approaches

“…Balcı et al [32] offered a solution for subsurface stresses in graded coatings subjected to frictional contact with heat generation. Su et al [33] investigated an effective method for the sliding frictional contact of a conducting cylindrical punch on FGPMs and Benaissa et al [34] studied quastatic frictional thermos-piezoelectric contact problem. Continuous contact problem of thermoelectric layer pressed by a rigid punch was studied by Chenxi and Shenghu [35] and Çömez [36] examined thermoelastic receding contact problem of a layer resting on a half plane.…”