Quaternary ammonium-based levelers for high-speed microvia filling via Cu electrodeposition

Lee, Myung Hyun; Lee, Yoon Jae; Kim, Jung Ah; Jeon, Youngkeun; Kim, Myung Jun; Kim, Young Gyu; Kim, Jae Jeong

doi:10.1016/j.electacta.2022.140389

Cited by 13 publications

(4 citation statements)

References 69 publications

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“…In recent years, copper electrodeposition from acidic electrolytes has been widely used in the printed circuit board (PCB) and integrated circuit industry. , With the development of the microelectronics industry, electronic devices are being refined. Multilayer PCBs with high-density interconnect are one of the key components in the manufacture of these electronic products. , Through-holes (THs) are usually used to realize the interconnection between layers on the PCB board. − To achieve a uniform and qualified copper coating, the addition of multiple additives is necessary.…”

Section: Introductionmentioning

confidence: 99%

“…In recent years, copper electrodeposition from acidic electrolytes has been widely used in the printed circuit board (PCB) and integrated circuit industry. 1,2 With the development of the microelectronics industry, electronic devices are being refined. Multilayer PCBs with high-density interconnect are one of the key components in the manufacture of these electronic products.…”

Section: Introductionmentioning

confidence: 99%

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Strong Convection-Dependent Adsorption of Phenothiazine Skeleton Levelers and Their Application in Copper Electroplating

et al. 2023

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The design and synthesis of high-performance levelers remain a major challenge to date. Herein, a series of phenothiazine (PTZ) derivatives were designed and synthesized, and they had a butterfly conformation, and their adsorption capacities were easier to modulate. To check out the inhibition capabilities among these eight PTZ derivatives, electrochemical measurements and theoretical calculations were carried out, and PTZ-8 indicated the strongest inhibition capabilities among these PTZ derivatives. Besides, galvanostatic measurements were also carried out to evaluate the overall performance of the levelers. The results showed that PTZ-8 had a potential oscillation, but PTZ-6 had strong convection-dependent adsorption. Due to the potential oscillation of PTZ-8, PTZ-6 as the representative leveler was selected for through-hole electrodeposition. In addition, field-emission scanning electron microscope images and X-ray diffraction results displayed the surface morphology, which indicated that the addition of PTZ-6 could lead to a fine copper deposit and cause the preferential orientations of copper deposits to change from [220] to [111]. This study might lay the foundation for the design of high-performance levelers.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Strong Convection-Dependent Adsorption of Phenothiazine Skeleton Levelers and Their Application in Copper Electroplating

et al. 2023

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“…In the process of electroplating, due to the edge effect, the plating rate at the opening is higher than that inside microvias, and the change in the copper ion concentration is more easily affected by the mass transfer than that at the opening. , In the process of electrodeposition, the copper ion consumption rate is higher than the supply rate, which leads to a decrease in the plating rate . Therefore, it is particularly important to develop appropriate additives and optimize electroplating conditions to lower the deposition rate of copper at the opening as well as the inner wall of microvias, while the deposition of copper at the bottom of microvias is not suppressed, thus achieving superconformal filling in the process of PCB copper plating .…”

Section: Introductionmentioning

confidence: 99%

Experimental and Theoretical Study of the New Leveler Basic Blue 1 during Copper Superconformal Growth

Li,

et al. 2023

ACS Appl. Mater. Interfaces

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A novel chlorinated functional group-modified triphenylmethane derivative leveler BB1 is used to achieve superconformal electrodeposition in microvias. Cyclic voltammetry (CV) and electrochemical impedance spectroscopy (EIS) are performed to study the suppressing effect of BB1, while the convection-dependent adsorption of BB1 on the copper surface is analyzed by galvanostatic measurement, and a BB1 concentration window between 100 and 200 mg/L is beneficial for superfilling. The interactions among BB1, bis-(sodium sulfopropyl) disulfide (SPS), and poly(ethylene glycol) (PEG) are also investigated. Density functional theory (DFT) calculation and in situ Raman spectroscopy are coupled to study the suppression mechanism and synergistic suppression mechanism, namely, the adsorption effect between BB1 and copper substrate, as well as the coordination effect between the modified chlorinated functional group and Cu 2+ , is proposed. The copper layer becomes smoother and more compact with an increase in BB1 concentration, according to scanning electron microscopy (SEM) and atomic force microscopy (AFM), while X-ray diffraction (XRD) analysis shows that the introduction of BB1 is conducive to the formation of the copper (220) plane. Besides, the solution wettability is boosted by BB1. A copper interconnecting layer with high quality is achieved with 150 mg/L BB1, while the surface deposition thickness (SDT) is about 34 μm and filling percentages (FPs) for microvias with diameters of 100, 125, and 150 μm are 81. 34, 82.72, and 81.39%, respectively.

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“…For example, metallization of electronic devices can be achieved by Cu electrodeposition. The introduction of organic/inorganic additives to the electrolyte has enabled nano-and micro-scale concave features, such as damascene interconnections, [30][31][32][33] through-silicon vias (TSVs), [34][35][36][37][38][39] microvias, [40][41][42][43] through holes, 44,45 and redistribution layers (RDLs), 46 to be filled with Cu. An important application of electrodeposition involves the development of electrocatalysts for energy conversion and storage.…”

mentioning

confidence: 99%

Shape Control of Metal Nanostructures by Electrodeposition and their Applications in Electrocatalysis

Yeo¹,

Eo²,

Kim³

et al. 2022

J. Electrochem. Soc.

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The 3D structure of metal deposits significantly impacts the electrocatalytic performance of these materials. The topic has been extensively researched because meaningful structural control of metal and alloy deposits can greatly improve electrochemical energy conversion and storage performance. This review describes several means of controlling metal-nanoparticle structure using electrodeposition. Hard templates, such as anodized aluminum oxide, polycarbonate membranes, and polystyrene particles, can dictate the location of metal growth when used in conjunction with electrochemical deposition. Nanowires, nanobarcodes, nanotubes, and inverse opal metal structures have been created by this approach. Gas evolution at the surface during metal deposition induces the formation of metal foams with high porosity. Pulse electrodeposition is an effective means of modulating the structures of metal deposits when applied under mass transfer-limited conditions and/or in the presence of additives. This review provides representative examples of 3D metal-nanostructure fabrication via electrodeposition and its applications in methanol/ethanol oxidation, water splitting, and CO2 reduction reactions.

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Quaternary ammonium-based levelers for high-speed microvia filling via Cu electrodeposition

Cited by 13 publications

References 69 publications

Strong Convection-Dependent Adsorption of Phenothiazine Skeleton Levelers and Their Application in Copper Electroplating

Strong Convection-Dependent Adsorption of Phenothiazine Skeleton Levelers and Their Application in Copper Electroplating

Experimental and Theoretical Study of the New Leveler Basic Blue 1 during Copper Superconformal Growth

Shape Control of Metal Nanostructures by Electrodeposition and their Applications in Electrocatalysis

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