Fabrication of sub-micron Josephson junctions is demonstrated using standard processing techniques for high-coherence, superconducting qubits. These junctions are made in two separate lithography steps with normal-angle evaporation. Most significantly, this work demonstrates that it is possible to achieve high coherence with junctions formed on aluminum surfaces cleaned in situ with Ar milling before the junction oxidation. This method eliminates the angle-dependent shadow masks typically used for small junctions. Therefore, this is conducive to the implementation of typical methods for improving margins and yield using conventional CMOS processing. The current method uses electron-beam lithography and an additive process to define the top and bottom electrodes. Extension of this work to optical lithography and subtractive processes is discussed. Superconducting devices implemented as quantum bits (qubits) are among the leading candidates for building quantum computers. Key elements in all types of superconducting qubits are Josephson junctions, which are the non-linear elements in the superconducting circuitry. This non-linearity separates the two lowest energy levels from higher excitations, forming a two-level system as the physical qubit. Coherence times of superconducting qubits have been increased significantly in both 2D and 3D geometries (∼10-100µs) [1][2][3][4][5]. These relatively long coherence times, combined with fast, high-fidelity gate schemes, have enabled the demonstration of quantum error detection with superconducting devices [6][7][8].While the design and fabrication for various other elements that form quantum circuits, i.e., resonators, shunt capacitors, and inductors, have been well studied and brought into line with standard cleanroom techniques, the preparation of the non-linear Josephson junction is still typically conducted separately on a device-by-device basis. In general, low participation ratios from both the Josephson junction and it's immediate surroundings are essential to the success of present-day superconducting qubits [4,9]. This goal is typically achieved by shrinking the junction size. These low-loss junctions have predominantly been fabricated using a multi-angle shadowevaporation (SE) technique, because it naturally yields small structures in a single step process and works well enough for demonstrations of small-scale circuits [10,11]. SE is also convenient in that the oxidation of the base electrode is conducted in-situ on the as-deposited film and, then immediately covered by the top electrode.To satisfy the requirement of scalability of quantum circuits, it is becoming critical to bring the junction fabrication step in line with standard fabrication techniques. This is difficult with the angle-dependence of the SE technique because it limits the wafer size for preparing junctions with tight margins. One possible avenue is to use overlap junctions, as shown in Ref. [12], where the two electrodes of Josephson junctions are prepared in separate steps. The coherence time...