Qubit-compatible substrates with superconducting through-silicon vias

Grigoras, K.; Yurttagül, N.; Kaikkonen, J. -P.; Mannila, E. T.; Eskelinen, P.; Lozano, D. P.; Li, H. -X.; Rommel, M.; Shiri, D.; Tiencken, N.; Simbierowicz, S.; Ronzani, A.; Hätinen, J.; Datta, D.; Vesterinen, V.; Grönberg, L.; Biznárová, J.; Roudsari, A. Fadavi; Kosen, S.; Osman, A.; Hassel, J.; Bylander, J.; Govenius, J.

doi:10.48550/arxiv.2201.10425

Cited by 2 publications

(2 citation statements)

References 28 publications

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“…Even if the qubits can be densely packed up on a chip (size: L × L), it is nevertheless extremely difficult to route all the control wires from the perimeter (length ∝ L) to individual qubits (density ∝ L 2 ) due to the unmatched scaling law; let alone to avoid crosstalk between wires. In recent years, there have been substantial efforts to exploit the third dimension to relieve this pain with various technologies borrowed from the semiconductor chip packaging, such as flip-chip bonding and through-silicon vias [331][332][333][334][335][336][337][338]. Aside from expanding the space for wiring, a different approach is to reuse the wire for multiple targets.…”

Section: Superconducting Qubitsmentioning

confidence: 99%

Noisy intermediate-scale quantum computers

Cheng

Deng

et al. 2023

Front. Phys.

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Quantum computers have made extraordinary progress over the past decade, and significant milestones have been achieved along the path of pursuing universal fault-tolerant quantum computers. Quantum advantage, the tipping point heralding the quantum era, has been accomplished along with several waves of breakthroughs. Quantum hardware has become more integrated and architectural compared to its toddler days. The controlling precision of various physical systems is pushed beyond the fault-tolerant threshold. Meanwhile, quantum computation research has established a new norm by embracing industrialization and commercialization. The joint power of governments, private investors, and tech companies has significantly shaped a new vibrant environment that accelerates the development of this field, now at the beginning of the noisy intermediate-scale quantum era. Here, we first discuss the progress achieved in the field of quantum computation by reviewing the most important algorithms and advances in the most promising technical routes, and then summarizing the next-stage challenges. Furthermore, we illustrate our confidence that solid foundations have been built for the fault-tolerant quantum computer and our optimism that the emergence of quantum killer applications essential for human society shall happen in the future.

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Section: Superconducting Qubitsmentioning

confidence: 99%

Noisy intermediate-scale quantum computers

Cheng

Deng

et al. 2023

Front. Phys.

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“…Another approach involves the utilization of parallel plate capacitors using van der Waals materials [20,21] for the same purpose. Flip-chip module [18,[22][23][24][25] and three-dimensional (3D)-integration scheme with throughsilicon vias (TSVs) [26,27] take full advantage of the 3D space, which improve the signal integrity and quantum decoherence induced by the wire-bonding technique.…”

Section: Introductionmentioning

confidence: 99%

Scaling superconducting quantum chip with highly integratable quantum building blocks

X¹,

Zhou²,

Wu³

et al. 2023

Supercond. Sci. Technol.

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Designing and fabricating large-scale superconducting quantum chips with increasing number of qubits is a pressing challenge for the quantum computing. Here, we propose a 3D stacked chip architecture comprised with quantum building blocks. In which, two primary types of blocks are the qubit block and the coupling block. They are designed as functional parts those can be utilized within the same footprint across multiple levels of the chip stack in the vertical direction. Common technological problems, such as the sensitivity of capacitors and coupling strengths to fabrication parameters, and dielectric losses from interfaces, can be addressed at the intra-block or block level efficiently. Once a library of standard blocks is designed and verified, they can be selected and arranged into arrays on chips at the placing stage of the design flow for specific quantum applications. Such chip structure and design protocol will reduce the design difficulty, and promote the reuse of standard blocks, thus paving the way for chips for noisy intermediate-scale quantum computing and quantum error correction.

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Qubit-compatible substrates with superconducting through-silicon vias

Cited by 2 publications

References 28 publications

Noisy intermediate-scale quantum computers

Noisy intermediate-scale quantum computers

Scaling superconducting quantum chip with highly integratable quantum building blocks

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