R&D for the CLIC vertex and tracking detectors

Abstract

A : Significant progress has been made to develop silicon pixel technologies for use in the vertex and tracker regions of the proposed Compact Linear Collider (CLIC) detector design. The electron-positron collisions generated by this linear accelerator provide a clean, low-radiation environment for the inner detectors. However, physics-driven performance targets, the CLIC beam structure, and occupancies from beam-induced backgrounds place challenging requirements on detector technologies for this region. A pixel pitch down to 25×25 µm 2 , material budget ≤ 0.2-2%X 0 per layer, average power dissipation of down to 50 mW cm −2 , position resolution of 3-7 µm, and timing resolution as low as 5 ns are called for in the vertex and tracking detectors. To this aim, a comprehensive R&D programme is ongoing to design and test silicon pixel detectors to fulfil these specifications, including both monolithic and hybrid devices. These studies involve Allpix 2 Monte Carlo and TCAD simulations, advanced 65 nm ASIC and sensor design, laboratory testing, and beam tests of individual modules to determine the required performance parameters. The characterisation and simulation modelling of these devices has also lead to the development of a set of tools and software within the CLIC detector and physics (CLICdp) collaboration. This publication will present recent results from the technologies being developed and tested in view of the CLIC vertex and tracking detector requirements, such as various monolithic CMOS sensors, and fine pitch hybrid assemblies with planar sensors.

Silicon Vertex and Tracking Detector R&D for CLIC

“…A single-chip bump-bonding process for CLICpix2 ASICs has been studies. The interconnect yield of the fine-pitch bump bonding was tested extensively in laboratory measurements and a yield of up to 97.9% was found [4] .…”

Efficient Analysis of Test-beam Data with the Corryvreckan Framework

“…It was initially developed within the CLIC Detector & Physics (CLICdp) collaboration [6,7] and is now employed and extended by a number of users and developers from different experiments supporting an increasing variety of sensor prototypes. A number of publications underline the versatility and the success of the framework [8][9][10][11][12][13][14][15]. Through its modularity, it aims to maximize synergies between different research groups by providing a reusable and extendable code basis and thus suppressing the need for numerous similar frameworks.…”

Silicon pixel sensor R&D for the CLIC tracking detector

“…For the ultra-low mass vertex detector, different small pitch (25 µm) hybrid technologies with innovative sensor concepts are explored [7]. A dedicated readout chip called CLICpix2 [8] has been developed in 65 nm CMOS technology and bump-bonded to thin planar active-edge sensors [9]. To overcome the challenges of the fine-pitch bump-bonding, alternative interconnection techniques Table 1.…”