1999
DOI: 10.1109/23.819148
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Radiation effects on advanced flash memories

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Cited by 140 publications
(54 citation statements)
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“…Characterisation curves for drain current as a function of gate voltage for transistors in programmed and erased states are shown in Figure 3. Recently it was believed that the flash memory cells were much less sensitive to ionizing radiation compared to control circuitry and charge pumps [2], but scaling of advanced flash memory has led to its sensitivity increasing.…”
Section: Introductionmentioning
confidence: 99%
“…Characterisation curves for drain current as a function of gate voltage for transistors in programmed and erased states are shown in Figure 3. Recently it was believed that the flash memory cells were much less sensitive to ionizing radiation compared to control circuitry and charge pumps [2], but scaling of advanced flash memory has led to its sensitivity increasing.…”
Section: Introductionmentioning
confidence: 99%
“…The same sequence of read/erase/verify/program/read applied to many earlier studies of TID on flash memory devices. The first generation of NAND flash memories failed to erase at the very low dose rate of 10krad(Si) [4].…”
Section: Tid Test Resultsmentioning
confidence: 99%
“…Only a few blocks cannot be programmed at 100 krad(Si). Previous generations of flash devices showed functional failures after 10-15krad(Si) [4], [7]. The worst case is static biasing during irradiation.…”
Section: Discussionmentioning
confidence: 99%
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“…In addition, special commands can be sent to AuxBoard to obtain information on quantity of SEL & SEU experienced, free memory etc. Flash memories (5 x 28F640 -64Mbits of capacity each) were the largest NOR ones freely available and tested under radiation conditions during design consideration [10]. Memory chips are controlled by Actel ProASIC250 (A3P250) Flash FPGA [11].…”
Section: Fig 3 Auxiliary Board Block Diagrammentioning
confidence: 99%