2005
DOI: 10.4218/etrij.05.0205.0031
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Radiation Effects on the Power MOSFET for Space Applications

Abstract: The electrical characteristics of solid state devices such as the bipolar junction transistor (BJT), metal‐oxide semiconductor field‐effect transistor (MOSFET), and other active devices are altered by impinging photon radiation and temperature in the space environment. In this paper, the threshold voltage, the breakdown voltage, and the on‐resistance for two kinds of MOSFETs (200 V and 100 V of VDSS) are tested for γ‐irradiation and compared with the electrical specifications under the pre‐ and post‐irradiatio… Show more

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Cited by 40 publications
(18 citation statements)
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“…A simple method fo r estimating the threshold voltage shift [2] fo r the commercial grade components due to the ionizing irradiation of a low dose rate was recently proposed fo r PWM-IC. Briefly, the method consists of estimating the threshold voltage shift by the oxide charge trapping at the gate oxide immediately after irradiation.…”
Section: Design Of Circuitmentioning
confidence: 99%
See 1 more Smart Citation
“…A simple method fo r estimating the threshold voltage shift [2] fo r the commercial grade components due to the ionizing irradiation of a low dose rate was recently proposed fo r PWM-IC. Briefly, the method consists of estimating the threshold voltage shift by the oxide charge trapping at the gate oxide immediately after irradiation.…”
Section: Design Of Circuitmentioning
confidence: 99%
“…The power consumed in PWM-IC is computed as fo llows. (I) where Ie in simulation is the current of 14 rnA flowing in the SG 1525A voltage mode pulse width modulator IC, f is the frequency with a value of 85 Khz, and Qg is the gate charge with a value of 120 nC fo r turning-on the MOSFET [2]. Then, the input power becomes 400 mW and the output becomes 295 mW, and the efficiency is 73.8 % based on load resistance of 0.028 Q.…”
Section: Introductionmentioning
confidence: 98%
“…Interface trap charges created during manufacture of a transistor at silicon (Si) and oxide (SiO 2 ) interface degrades the device performance [7] and it can be serious device reliability issues. These interface traps are induced due to: (1) process induced damage [8], (2) stress induced damage [9], (3) radiation induced damage [10] and (4) hot carrier induced damage [11]. A lot of research work has been carried out to study the device electrical performance degradation due to interface trap charges in inversion mode (junction-based) transistor [12][13].…”
Section: Introductionmentioning
confidence: 99%
“…A simple method for estimating the threshold voltage shift due to ionizing irradiation at low dose rates was recently proposed for power MOSFETs [1]. The method consists of estimating the threshold voltage shift due to oxide charge trapping at the MOS immediately after irradiation.…”
Section: Introductionmentioning
confidence: 99%