“…Using an ion-implantation energy of 70 keV, the polysilicon is doped to a level of 1 x 10 16 /cm 2 with boron. More recently, Cricchi et al 218, 219 have built and tested MNOS-SOS EAROMs as well as CMOS-SOS circuits with nitride-oxide gate dielectrics and obtained similar results to that of Brucker. Aluminum is deposited from a filament system and alloyed at 450 °C.…”