2006
DOI: 10.1109/tns.2006.872202
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Radiation hardness after very high neutron irradiation of minimum ionizing particle detectors based on 4H-SiC p/sup +/n junctions

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Cited by 64 publications
(56 citation statements)
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“…37 The graphene sheets we used are monolayer everywhere, and we transfer them to SiO2/Si substrate, the binding energy between carbon atoms in graphene and SiO2/Si is few meV 38 and is much weaker than the interactions with SiC substrate, which results in less effective for the resistance of graphene to bump. Another reason is that SiC has higher values for the electron-hole pair production energy (7.8-9 eV), 39 which proves it to be a radiation-harder material, as compared to SiO2. This again confirms the substrate plays an important role during the formation process of nanostructures on graphene.…”
Section: B the Fabrication Of Nanodot Array Experimentallymentioning
confidence: 99%
“…37 The graphene sheets we used are monolayer everywhere, and we transfer them to SiO2/Si substrate, the binding energy between carbon atoms in graphene and SiO2/Si is few meV 38 and is much weaker than the interactions with SiC substrate, which results in less effective for the resistance of graphene to bump. Another reason is that SiC has higher values for the electron-hole pair production energy (7.8-9 eV), 39 which proves it to be a radiation-harder material, as compared to SiO2. This again confirms the substrate plays an important role during the formation process of nanostructures on graphene.…”
Section: B the Fabrication Of Nanodot Array Experimentallymentioning
confidence: 99%
“…As an example, in Ref. [7] the authors report how the room temperature current density of epitaxial SiC pn junctions made on 55 mm thick epitaxial layer decreased from 60 to 20 nA/cm 2 after an irradiation of 10 16 n/cm 2 .…”
Section: Leakage Currentmentioning
confidence: 99%
“…The SiC device has a thickness of 55 mm, data are redrawn from Ref. [7]. The current density of the Si device (300 mm thick) has been calculated using Eqs.…”
Section: Leakage Currentmentioning
confidence: 99%
“…Hence, there is a need to explore materials beyond Si with enhanced properties to operate in extreme environments. For such applications, many material technologies have been explored [1][2][3][4][5]. Among them, the wide bandgap semiconductor 4H-SiC is a promising candidate for high temperature and radiation applications due to its relatively high atomic displacement energy (20-35 eV), three times larger bandgap, and higher temperature conductivity compared to Si [5,6].…”
Section: Introductionmentioning
confidence: 99%