2015
DOI: 10.1016/j.nimb.2014.12.064
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Radiation hardness of n-type SiC Schottky barrier diodes irradiated with MeV He ion microbeam

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Cited by 8 publications
(7 citation statements)
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“…2). A similar shift was already observed in 4H-SiC epi-layers irradiated with protons, alpha particles and electrons, and it was interpreted as the release of stress produced by defect clusters [30,31];…”
Section: Resultssupporting
confidence: 76%
“…2). A similar shift was already observed in 4H-SiC epi-layers irradiated with protons, alpha particles and electrons, and it was interpreted as the release of stress produced by defect clusters [30,31];…”
Section: Resultssupporting
confidence: 76%
“…After the sample was bombarded, it was observed that two defects were introduced by irradiation. One of the defects had a broad peak, probably due to the presence of several states or defects with closely spaced emission rates as observed earlier [22]. The irradiation induced defects were labelled as E 0.39 and E 0.62 .…”
Section: Tablesupporting
confidence: 58%
“…Initial electrical measurements proved the excellent quality of prepared pristine SBD samples having a reverse current of the order of few pA and a terminal capacitance below 10 pF at -40 V (not shown here) [24]. The calculated free carrier concentration in pristine sample was ~ 5 × 10 14 cm -3 across the thickness of epitaxial layer.…”
Section: A Pre-implantationmentioning
confidence: 73%
“…The ion species and energies were chosen to obtain the lattice atom displacement density distribution within the depletion region of reversely biased partially damaged SBDs examined by the DLTS. The He ion fluence values used for these measurements correspond to the fluence range in which the charge collection efficiency in selectively implanted 4H-SiC epi-layers decreases linearly as a function of fluence, as demonstrated in our previous radiation hardness study of these epitaxial layers using the IBIC microscopy [24]. A negligible error of the calculated fluence values might be caused by a dead time of the data acquisition system.…”
Section: Methodsmentioning
confidence: 88%