Radical flux control in reactive ion beam etching (RIBE) by dual exhaust system

In order to etch CoFeB and MgO constituting the magnetic tunnel junction (MTJ) layer of magnetic random access memory, rf-biased reactive ion beam etching (RIBE) with a H2:NH3 gas mixture was introduced and the etching characteristics were investigated. The H2:NH3 gas mixture of 8:1 was used for rf-biased RIBE because the etch selectivity is increased with H2 percentage in the H2:NH3 gas mixture while the etch rates of MTJ materials are the highest between 2:1 and 1:1 ratio of H2:NH3 due to the synergy effect of H2 and NH3 in the etching of MTJ materials. When a high rf power was applied to the substrate (high rf-biasing) during RIBE, even though etch rates of MTJ materials were increased, the etch selectivities of MTJ materials over hard mask materials were decreased possibly due to the high physical sputtering effect. However, when small rf-biasing was added to the substrate during RIBE, improved etch characteristics such as higher etch selectivity of MTJ over the top electrode (TE) material, improved etch anisotropy of the MTJ pattern masked with TE, and a thinner sidewall residue on the MTJ pattern could be observed. The improvement in etch characteristics by the addition of small rf-biasing during RIBE is believed to be related to the increased chemical etching effect through H2/NH3 gas dissociation and the increased H/NH ratio in the plasma generated just above the substrate without increasing the physical sputtering effect. Specifically, for the substrate located on the insulating substrate holder, the charging of the substrate could be removed without using an electron emitting neutralizer by supplying electrons from the plasma generated by rf-biasing during RIBE.

show abstract

scite is a Brooklyn-based organization that helps researchers better discover and understand research articles through Smart Citations–citations that display the context of the citation and describe whether the article provides supporting or contrasting evidence. scite is used by students and researchers from around the world and is funded in part by the National Science Foundation and the National Institute on Drug Abuse of the National Institutes of Health.

Contact Info

customersupport@researchsolutions.com

10624 S. Eastern Ave., Ste. A-614

Henderson, NV 89052, USA

This site is protected by reCAPTCHA and the Google Privacy Policy and Terms of Service apply.

Blog Terms and Conditions API Terms Privacy Policy Contact Cookie Preferences Do Not Sell or Share My Personal Information

Made with 💙 for researchers

Part of the Research Solutions Family.

Radical flux control in reactive ion beam etching (RIBE) by dual exhaust system

Cited by 2 publications

References 21 publications

Plasma atomic layer etching of ruthenium by oxygen adsorption-removal cyclic process

Plasma atomic layer etching of ruthenium by oxygen adsorption-removal cyclic process

Study on etch characteristics of magnetic tunnel junction materials using rf-biased H2/NH3 reactive ion beam

Contact Info

Product

Resources

About