Nanoparticles (NPs) can improve mechanical properties of construction elements. However, the integration is not trivial due to the nanoscopic nature of the particles and the different material properties of particle and device: new processing routes have to be found for homogeneous incorporation. Therefore, a wet chemical synthesis is established to incorporate various ceramic NPs such as TiO 2 , TiC, SiC, and WC in copper films in desired concentrations. Depending on the kind and concentration of NPs, hardness and wear resistance of copper are enhanced. The resulting metal matrix composite films are thus of high interest for various applications such as reinforced electrical contacts and in aerospaceand automotive technology.The energy releasedinan exothermic reaction ofa reactive multilayer system (RMS) can be used as a precise and well-defined local heat source for joining the surface of polymers. In this case, a RMS consisting of alternating layers of nickel and aluminum is used. Thedesign oftheRMSisadjustedina waythatdespitetheintensivebut veryshort reaction nodamaging ofthepolymersoccurs.Thejoiningprocesstakesonlymillisecondsanddoesnotrequireanypre-orposttreatment of the polymers. With the optimal joining parameters, e.g., the joining load, for fiber nonreinforced polymers tensile strengths can be achieved, which lead to a material failure by tensile attempts. Preliminary tests of fiber reinforced polymers result in a tensile strength that is characteristic for adhesive polymer bonding. Model simulations show that only the first few micrometers of the materials surface are in a liquid state for a very short period of time. In addition to the applied joining load,thematerialscomposition andspecificallytheresulting solidificationprocessoftheliquidpolymer phase result in a strong bond between polymer samples that have to be joined. Materials with different thermal expansion coefficients are difficult to join thermally. Among them is the joining of solar cells. It is conventionally carried out by heating the whole assembly. Due to the thermal differences between tabbing wire and silicon, deformations as well as changes in the microstructure can occur. In the worst case, damage of the whole assembly is possible. Upon inspection of the joining process, the high energy consumption of the process itself is also critical.