In this study, we present a new method named seed-induced lateral crystallization (SILC), wherein the Ni that is deposited on amorphous silicon (a-Si) is removed prior to crystallization. The newly developed polycrystalline silicon (poly-Si) thin-film transistor (TFT) exhibits a field effect mobility of 63 cm 2 /V-s, leakage current of 7.9 × 10 −11 A, slope of 0.8 V/dec, I on of 2.8 × 10 −4 A at V D = 10 V, and V TH of 5.5 V. The leakage current has been reduced by an order of magnitude as compared with conventional metal-induced lateral crystallized (MILC) poly-Si TFTs, in which Ni is removed after the crystallization. In order to materials analysis, Raman scattering spectroscopy and field emission scanning electron microscopy (FESEM) was used. Since a batch process is possible in MILC technology, it is more advantageous than the excimer laser annealing (ELA) technology for mass production of a large size display. Since SILC TFT shows a leakage current comparable to an ELA poly-Si TFT, its application to the mass production of AMOLED display is expected have a substantial impact on the industry. Active matrix organic light emitting diode (AMOLED) technology has many advantages over liquid crystal display (LCD) in terms of display functions and is, therefore, beginning to replace LCD technology. Because AMOLED requires low-temperature polycrystalline silicon (poly-Si) thin-film transistors (TFTs), for which no industrial technology is yet known, very limited and only small size display is available so far. The excimer laser annealing (ELA) is a typical low-temperature crystallization method but suffers from two critical problems, which have not yet been overcome in terms of cost for mass production. One is the inevitable scan overlap, which leads to crystal non-uniformity; the other is the resulting surface roughness, which stems from a liquid-solid phase transformation.