2009
DOI: 10.1016/j.apsusc.2009.05.087
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Raman scattering analysis of the residual stress in metal-induced crystallized amorphous silicon thin films using nickel

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Cited by 20 publications
(8 citation statements)
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“…Consistently, we observed a gradual decrease in FWHM of the crystalline Si peak from w9.0 to 5.4 cm À1 with the increase in T f . The reduction in FWHM of the crystalline Si peak is correlated to the improvement in crystalline quality to form less defect or defectfree structures [46]. This agreed well with the XRD analysis as mentioned earlier.…”
Section: Micro-raman Analysissupporting
confidence: 71%
“…Consistently, we observed a gradual decrease in FWHM of the crystalline Si peak from w9.0 to 5.4 cm À1 with the increase in T f . The reduction in FWHM of the crystalline Si peak is correlated to the improvement in crystalline quality to form less defect or defectfree structures [46]. This agreed well with the XRD analysis as mentioned earlier.…”
Section: Micro-raman Analysissupporting
confidence: 71%
“…It is important to recognize that the changes in lattice parameters could result directly from the annealing process. Indeed, annealing (commonly defined as "heating and allowing to cool slowly, in order to remove internal stress") is well known to increase crystallinity independent of organic matter (Choi et al, 1999;Nasdala et al, 2001;Nguyen et al, 2009). …”
Section: Insights From Annealing Experimentsmentioning
confidence: 99%
“…This fwhm is also related to the concentration of Ni silicide trapped at the grain boundaries so that it can be concluded that SILC shows the lowest defect concentration among these polycrystallines. 23 To observe the surfaces of MILC and SILC poly-Si samples using FESEM, samples were Secco etched after crystallization annealing at 550 • C for 4 h. It is known that Secco etchant can etch α-Si and Ni silicide from crystalline Si selectively. 24 In Fig.…”
Section: Resultsmentioning
confidence: 99%