Abstract— The development of fabrication processes for polycrystalline‐silicon thin‐film transistors (poly‐Si TFTs) at low temperatures will be discussed. Rapid crystallization of silicon films through laser‐induced melt regrowth has the advantage of having a low thermal budget. Solid‐phase crystallization techniques have also been improved for low‐temperature processing. Passivation of the SiO2/Si interface and crystalline grain boundaries is important in achieving high‐carrier‐transport properties. Oxygen‐plasma and H2O‐vapor heat treatments are proposed for the effective reduction of the density of defect states. TFTs with high performances will be reported.