Rapid formation of intermetallic compounds interdiffusion in the CuSn and NiSn systems

Effect of thermal aging on the interfacial reactions of tin-based solder alloys and copper substrates and kinetics of formation and growth of intermetallic compounds

“…The results of the activation energies for the total IMC thickness and for the individual phases for the four solder alloys are presented in Table 3. The activation energy data for the Cu/Sn-3.5Ag and Cu/Sn-0.7Cu joint systems are in good agreement with previous studies found in the literature [3,8]. In the case of the Cu/Sn-3.2Ag-0.8Cu and Cu/Sn-9Zn joint systems, no comparison data were found in the literature.…”

“…In the tin/copper and tin-rich-alloys/copper joint systems, the intermetallic Cu 6 Sn 5 (h'-phase) formed immediately upon contact of the liquid solder with the copper substrate [7,8]. Then, the intermetallic compound grew rapidly [9,10].…”

Intermetallic Growth Retardation with the Addition of Graphene in the Sn-3.5Ag Lead-free Solder

“…IMC is a layer that generated by chemical reaction between solder alloy and substrate during the soldering process which can grow via diffusion in the solid state. For the Sn-Ag/Cu couple, the interfacial IMC layer consists of Cu 6 Sn 5 and Cu 3 Sn binary compounds and these layer were generated during the soldering process and grew in the high temperature environment [4]. Many studies have been done to further improve the solder properties in order to reduce the IMC growth by adding extra element such as In, Bi, and Zn into the solder alloys [5][6][7][8].…”

Formation and Growth of Intermetallic Compound Cu6Sn5 at Early Stages in Lead-Free Soldering

“…[4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] These works suggest that, upon contact, Cu and liquid Sn react to form two distinct IMCs [Cu 6 Sn 5 (g phase) and Cu 3 Sn (e phase)], which precipitate at different stages of the soldering reaction. Most research seems to suggest that, at the very early stages of the soldering reaction, the g phase precipitates first.…”

“…19 Earlier works have focused on experimental characterization of the late stages of growth and coalescence of g and e phases during lead-free soldering reactions between Sn and Cu. [4][5][6][7][8][9][10][11][12][13][14][15][16][17][18] More recently, several groups have investigated the formation of the g phase at the early stages of soldering reactions. [20][21][22][23] These latter works have found that individual Cu 6 Sn 5 grains seem to appear at random positions along the (metastable) solid/liquid interface within a few milliseconds.…”