Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process

Abstract

High melting point NiSn joints for the die attachment of SiC-based high temperature power devices was successfully achieved using an ultrasound-induced transient liquid phase (TLP) bonding process within a remarkably short bonding time of 8s. The formed intermetallic joints, which are completely composed of the refined equiaxial NiSn grains with the average diameter of 2μm, perform the average shear strength of 26.7MPa. The sonochemical effects of ultrasonic waves dominate the mechanism and kinetics of the rapid formation of NiSn joints.

Low‐temperature ultrasound‐activated joining of ZrO2 ceramics using Sn–Al–Cu solder

“…Ultrasonic waves have been widely utilized to assist the soldering or brazing processes in previous studies . The propagation of ultrasound could induce cavitation phenomenon, resulting in the localized high temperatures and pressure condition (hot spot effect) at the interface between the solid metals and the liquid solder, it would dramatically promote the occurrence of interfacial reaction, hence reducing the bonding temperature for joint formation.…”

Strategies to Reduce Transient Liquid Phase Bonding Time for the Die Attach of Power Semiconductors

“…Ultrasonic wave is applied to TLPB to produce microbubble in the joint 28,29) . Forming microbubbles in the liquid interlayer, the temperature and pressure reached locally 5000 K and 0.1 GPa, respectively, due to the of bubble implosion 29) . In such an environment, micropits are generated at metallization, and strong metallization dissolution occurs.…”

“…Li et al 29) applied the conventional TLPB to Ni/Sn/Ni structure with a Sn interlayer with a thickness of 20 ㎛ at 250 ℃ and the TLPB was completed in 120 minutes. Fig.…”

Microstructure evolution and grain refinement of ultrasonic-assisted soldering joint by using Ni foam reinforced Sn composite solder

“…A quick and effective way to create junctions with a high melting point at low temperatures is to use ultrasonic-assisted soldering [9] , [10] . According to previous research, ultrasonic-assisted soldering can accelerate metallurgic reaction and form fully IMCs joints in Ni-Sn system [11] , [12] . The cavitation and acoustic streaming caused by ultrasonic waves during the soldering process provide a localized environment with very high pressure and temperature, which encourages wetting and speeds up the metallurgical reaction [13] , [14] , [15] .…”