“…Firstly, suppression of cracking during formation of thin films and multilayer stacks, and secondly, fabrication of films with high mechanical and radiation stability [6,7]. In recent years, several methods have been developed to address the former challenge, including spin-coating from metal-peroxo solutions [8], firing processes at high temperatures (900-1000°C) [9,10], and the shock-cooling procedure of sol-gel dip-coated films developed in our group [11]. Achieving high mechanical and radiation stability is still very challenging in sol-gel methods.…”